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METHOD FOR FILLING RECESSED MICRO-STRUCTURES WITH METALLIZATION IN THE PRODUCTION OF A MICROELECTRONIC DEVICE

  • US 20020022363A1
  • Filed: 02/04/1998
  • Published: 02/21/2002
  • Est. Priority Date: 02/04/1998
  • Status: Active Grant
First Claim
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1. A method for filling recessed micro-structures at a surface of a semiconductor workpiece with copper metallization comprising the steps of:

  • depositing a copper layer into the micro-structures with a process generating copper grains that are sufficiently small so as to substantially fill the recessed microstructures;

    subjecting the deposited copper to an annealing process at a temperature below about 100 degrees Celsius.

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