Transmission line based inductively coupled plasma source with stable impedance

• US 20020023899A1
• Filed: 06/08/2001
• Published: 02/28/2002
• Est. Priority Date: 08/25/2000
• Status: Active Grant

• Current Assignee: Board of Regents of the University of Texas System (University of Texas System)
• Original Assignee: Board of Regents of the University of Texas System (University of Texas System)
• Inventors: Khater, Marwan H., Overzet, Lawrence J.
• Granted Patent: US 6,459,066 B1
• Time in Patent Office: Days
• US Class Current: 219/121.41
• CPC Class Codes: H01J 37/321 the radio frequency energy being inductively coupled to the plasma

Abstract

A properly designed and positioned Faraday shield/dielectric spacer/source-coil assembly is used to nearly fix the input impedance of an Inductively Coupled Plasma (ICP) source-coil, making a variable matching network almost unnecessary, and allowing for pulsed plasma processing with very little reflected power. Further, the nearly constant input-impedance also means a nearly constant standing wave pattern on the ICP source-coil and constant power deposition symmetry as well as plasma uniformity independent of RF power, gas pressure and gas composition. This is not possible without a properly designed and positioned Faraday shield because the source-coil impedance is coupled to that of the plasma and changes significantly with the plasma conditions. The ICP source-coil/dielectric spacer/Faraday shield assembly can then be designed to optimize the symmetry of the plasma generation independent of plasma conditions by varying the source coil structure, dielectric spacer material, dielectric spacer structure, and Faraday shield structure. An appropriately positioned aperture in the Faraday shield can allow enough capacitive coupling between the vacuum and ICP source coil to ignite the plasma while preventing any significant capacitive coupling during the subsequent high-density ICP phase.

Claims

1. A method for plasma processing, comprising the actions of:

a) driving a coil with an RF power source to thereby initiate a glow discharge in a process chamber, using capacitive coupling;

b) and thereafter inductively coupling power into said glow discharge from said coil;

wherein the impedance of said coil does not change by more than 3;

1 between said steps a) and b).

2. The method of claim 1, wherein said dielectric layer consists of at least one solid body.

3. The method of claim 1, wherein said coil is electromagnetically coupled to said chamber through a dielectric layer of nonuniform thickness, through a Faraday shield, and through a vacuum-sealed dielectric chamber wall.

4. An inductively-coupled-plasma reactor system, comprising:

an RF power source;

a driver coil which is inductively coupled to a process chamber; and

an impedance-matching stage connecting said power source and said coil;

wherein no component of said system provides impedance matching over a range of impedance magnitudes of more than 3;

1.

5. The system of claim 4, wherein said coil is electromagnetically coupled to said chamber through a dielectric layer of nonuniform thickness and through a Faraday shield.

6. The system of claim 4, wherein said coil is electromagnetically coupled to said chamber through a dielectric layer of nonuniform thickness, through a Faraday shield, and through a vacuum-sealed dielectric chamber wall.

7. A plasma processing station, comprising:

a chamber; and

a coil which is electromagnetically coupled to said chamber through a Faraday shield and through a nonuniform dielectric layer;

wherein the nonuniformity of said dielectric layer is positioned to increase the net uniformity of plasma generated in said chamber.

8. The station of claim 7, wherein said Faraday shield is also separated from the interior of said chamber by a dielectric vacuum-sealed wall.

9. The station of claim 7, wherein said dielectric layer consists of at least one solid body.

10. The station of claim 7, wherein said Faraday shield includes an aperture under a portion of said coil which does not include any voltage node on said coil.

11. The station of claim 7, wherein said dielectric layer has nonuniform thickness.

12. The station of claim 7, wherein the nonuniformity of said dielectric layer includes cutouts.

13. The station of claim 7, wherein said dielectric layer includes multiple different materials.

15. The method of claim 14, wherein said coil is electromagnetically coupled to said chamber through a dielectric layer of nonuniform thickness and through a Faraday shield.

17. The source structure of claim 16, wherein said coil has an approximately planar geometry.

18. The source structure of claim 16, wherein said coil has a Khater/Overzet/Cherrington geometry.

19. The source structure of claim 16, wherein said dielectric has a nonuniform thickness.

20. The source structure of claim 16, wherein said coil is electromagnetically coupled to said chamber through said dielectric, through said Faraday shield, and through a vacuum-sealed dielectric chamber wall.

14. A method for plasma processing, comprising the actions of:

driving a coil with an RF power source through a matching network to symmetrically energize a plasma which provides an electrical load to said coil,

while stabilizing the input impedance of said coil,

independently of said matching network,

to thereby maintain the input impedance of said coil independent of variations in the conditions of said plasma

and maintain symmetry in the energizing of said plasma independent of variations in the conditions of said plasma.

16. A plasma source structure, comprising in combination a Faraday shield and driver coil and dielectric, which are aligned, for a known standing-wave condition of said coil, such that nonuniformity of current magnitude on said coil is compensated by nonuniform geometry of said coil and/or said dielectric and/or said Faraday shield, to provide improved uniformity of power deposition into the plasma.

21. A method for plasma processing, comprising the actions of:

driving a coil,

which is electromagnetically coupled to a process chamber through a Faraday shield and through a nonuniform dielectric layer,

with RF power,

to thereby energize a glow discharge in the process chamber;

wherein the nonuniform thickness of said dielectric layer is positioned to increase the net uniformity of plasma generated in the chamber.

22. The method of claim 21, wherein said Faraday shield is also separated from the interior of said chamber by a vacuum-sealed dielectric wall.

23. The method of claim 21, wherein said coil has an approximately planar geometry.

25. The station of claim 24, wherein said coil has an approximately planar geometry.

26. The station of claim 24, wherein said coil has a Khater/Overzet/Cherrington geometry.

27. The station of claim 24, wherein said coil is electromagnetically coupled to said chamber through a dielectric layer of nonuniform thickness and through a Faraday shield.

29. The method of claim 28, wherein said coil is electromagnetically coupled to said chamber through a dielectric layer of nonuniform thickness and through a Faraday shield.

30. The method of claim 28, wherein said coil is electromagnetically coupled to said chamber through a dielectric layer of nonuniform thickness, through a Faraday shield, and through a dielectric chamber wall.

24. A plasma processing station, comprising:

a chamber; and

a coil which is electromagnetically coupled to said chamber and is operatively connected to be driven by an RF power supply at a frequency which induces at least one current node on said coil.

28. A method for plasma processing, comprising the actions of:

driving a coil which is electromagnetically coupled to a process chamber,

with RF power at a frequency which induces at least one current node on said coil,

to thereby energize a glow discharge in the process chamber.

31. A method for plasma processing, comprising the actions of:

initiating a glow discharge in a process chamber, using capacitive coupling, through at least one aperture in a Faraday shield, to a coil which is connected to an RF power source;

and thereafter inductively coupling power into said glow discharge from said coil through said Faraday shield, while said glow discharge blocks said capacitive coupling through said aperture.

32. The method of claim 31, wherein said Faraday shield also includes anti-eddy-current cutouts.

33. The method of claim 31, wherein said aperture of said Faraday shield is located under a portion of said coil which does not include any voltage node.

34. The method of claim 31, wherein said coil has an approximately Khater/Overzet/Cherrington geometry.

35. The method of claim 31, wherein said coil is electromagnetically coupled to said chamber through a dielectric layer of nonuniform thickness and also through said Faraday shield.

36. The method of claim 31, wherein said coil is electromagnetically coupled to said chamber through a dielectric layer of nonuniform thickness, through said Faraday shield, and through a vacuum-sealed dielectric chamber wall.

38. The method of claim 37, further comprising the action, after each pulse, of allowing a delay which is longer than the free electron lifetime before repeating said action a).

39. The method of claim 37, wherein said Faraday shield also includes anti-eddy-current cutouts.

40. The method of claim 37, wherein said Faraday shield includes an aperture under a portion of said coil which does not include any voltage node.

41. The method of claim 37, wherein said coil has an approximately Khater/Overzet/Cherrington geometry.

37. A method for pulsed plasma processing, comprising the actions of, at each pulse:

igniting a plasma in a chamber, using capacitive coupling, through at least one aperture in a Faraday shield, to a coil which is connected to an RF power source;

and thereafter inductively driving said plasma using said coil, while said plasma blocks said capacitive coupling through said aperture.

42. An inductively-coupled-plasma reactor system, comprising:

an RF power source;

an impedance-stabilized driver coil which is inductively coupled to a process chamber through a Faraday shield, and connected to receive pulsed power from said RF power source; and

an automatic impedance-matching stage, connecting said power source and said coil, which has a response time slower than the time between pulses of said pulsed power.

43. The system of claim 42, wherein said coil is electromagnetically coupled to said chamber through a dielectric layer of nonuniform thickness and through a Faraday shield.

44. The system of claim 42, wherein said coil is electromagnetically coupled to said chamber through a dielectric layer of nonuniform thickness, through a Faraday shield, and through a vacuum-sealed dielectric chamber wall.