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Semiconductor device

  • US 20020024140A1
  • Filed: 04/02/2001
  • Published: 02/28/2002
  • Est. Priority Date: 03/31/2000
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a silicon substrate;

    an interlayer dielectric film formed on said silicon substrate; and

    a layered interconnector having a first electrically conductive film formed on a surface of said interlayer dielectric film which first conductive film contains molybdenum as the main element thereof, a second electrically conductive film formed on a surface of said first electrically conductive film which second conductive film contains tungsten as the main element thereof, and a third electrically conductive film formed on a surface of said second film which third conductive film contains molybdenum as the main element thereof.

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