Chip-type light-emitting device

• US 20020024299A1
• Filed: 08/08/2001
• Published: 02/28/2002
• Est. Priority Date: 08/09/2000
• Status: Abandoned Application

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Okazaki, Tadahiro
• Application Number:
  US09/924,114
• Publication Number:
  US 20020024299A1
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

In a chip-type light-emitting device, terminal electrodes are formed at both ends of the surface of a chip substrate, and a light-emitting element and a diode for protecting the light-emitting element at least against a reverse voltage are connected in parallel between the terminal electrodes. The chip substrate is fitted with a reflective cover formed by integrally forming a reflecting portion that permits the light from the light-emitting element to exit from the chip-type light-emitting device in a predetermined direction and a light-shielding portion that shields the diode from the light entering the chip-type light-emitting device from outside. Alternatively, a light-shielding member is provided so as to cover the diode so that the diode is shielded from the light striking it. In either way, a leak current through the diode can be prevented.

Claims

1. A chip-type light-emitting device comprising a chip substrate, terminal electrodes formed at both ends of a surface of the chip substrate, a light-emitting element connected between the terminal electrodes, and a diode connected in parallel with the light-emitting element between the terminal electrodes, the diode serving to protect the light-emitting element at least against a reverse voltage,

wherein the chip substrate is fitted with a reflective case formed by forming integrally a reflecting portion that permits light from the light-emitting element to exit from the chip-type light-emitting device in a predetermined direction and a light-shielding portion that shields the diode from light entering the chip-type light-emitting device from outside.

2. A chip-type light-emitting device as claimed in claim 1,

wherein the reflecting portion is a cavity formed in the reflective case so as to surround the light-emitting element with an opening formed in the direction in which the light from the light-emitting element is permitted to exit, and the light-shielding portion is another cavity formed in the reflective case so as to surround the diode.

3. A chip-type light-emitting device comprising a chip substrate, terminal electrodes formed at both ends of a surface of the chip substrate, a light-emitting element connected between the terminal electrodes, and a diode connected in parallel with the light-emitting element between the terminal electrodes, the diode serving to protect the light-emitting element at least against a reverse voltage,

wherein a light-shielding member is provided so as to cover the diode so that the diode is shielded from light striking the diode.

4. A chip-type light-emitting device as claimed in claim 3,

wherein the light-shielding member is a box-shaped member that is open at a bottom thereof.

5. A chip-type light-emitting device as claimed in claim 3,

wherein the light-shielding member is a sealing member made of opaque resin in which the diode is sealed.