Circuit-like metallic foil sheet and the like and process for producing them

• US 20020025416A1
• Filed: 12/22/2000
• Published: 02/28/2002
• Est. Priority Date: 12/30/1994
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Miyake
• Original Assignee: Kabushiki Kaisha Miyake
• Inventors: Uchibori, Shinya
• Granted Patent: US 6,458,465 B1
• Time in Patent Office: Days
• US Class Current: 428/209
• CPC Class Codes: B32B 15/04 comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 15/12 of paper or cardboard
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: G08B 13/2414 using inductive tags
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/1476 Release layer
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31544 Addition polymer is perhalogenated
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

A resonant tag is provided that comprises a circuit-like metallic foil pattern that is adhered to a dielectric film prepared from a liquid resin by a coating process. The circuit-like metal foil pattern on one side of the dielectric film may be so aligned with the circuit-like metal foil pattern on the other side of the dielectric film as to form a capacitor with the dielectric film. The dielectric film may have openings therein configured similarly to and aligned with openings in the circuit-like metal foil, and the configuration of the circuit-like metal foil pattern and dielectric film may be generally spiral in configuration. An adhesion adhesive may be coated on predetermined portions of a face of a resonant tag base so as to leave uncoated portions between the coated portions, and a release paper is applied to the adhesion adhesive, the width of the uncoated portions being such as to avoid the generation of static electricity when the release paper is peeled from the adhesion adhesive.

Claims

1. A process for fabricating a circuit-like metallic foil sheet for resonant tag and the like,

said process using a laminate comprising a carrier sheet such as a paper or a plastic film adhered thereto a metallic foil as the base material, and

said process comprising:

patterning the metallic foil of said laminate using a stamping die to provide a predetermined circuit-like pattern on the metallic foil;

disposing the surface of a support such as a plastic film and the like opposed to the side of said laminate having thereon the metallic foil; and

transferring the circuit-like metallic foil to the surface of the support by heating said circuit-like patterned portion from the carrier sheet side of said laminate or from the support side.

2. A process for fabricating a circuit-like metallic foil sheet as claimed in claim 1, wherein,

said process uses, as the base material, a laminate comprising a carrier sheet adhered thereto a metallic foil and a coating of a thermal adhesive resin formed further thereon, and said process comprising:

patterning the metallic foil of said laminate using a stamping die to provide a predetermined circuit-like pattern on the metallic foil;

disposing the surface of a support opposed to the side of said laminate havint thereon the metallic foil; and

transferring the circuit-like metallic foil to the surface of the support by heating said circuit-like patterned portion from the carrier sheet side of said laminate or from the support side.

3. A process for fabricating a circuit-like metallic foil sheet as claimed in claim 1, wherein,

said process uses a laminate comprising a carrier sheet adhered thereto a metallic foil as the base material, and

said process comprising:

patterning the metallic foil of said laminate using a stamping die to provide a predetermined circuit-like pattern on the metallic foil;

disposing opposed to the side of said laminate having thereon the metallic foil, the surface of a support which itself is thermal adhesive or which has thereon a coating of a thermal adhesive; and

transferring the circuit-like metallic foil to the surface of the support by heating said circuit-like patterned portion from the carrier sheet side of said laminate or from the support side.

5. A process for fabricating a circuit-like metallic foil sheet as claimed in claim 1, wherein the metallic foils are adhered to the carrier sheets using an easily removable adhesive.

6. A process for fabricating a circuit-like metallic foil sheet as claimed in claim 5, wherein the adhesive used for adhering the metallic foils to the carrier sheets is characterized in that it comprises a blend of an adhesion adhesive and a curing agent, and that the adhesion force thereof decreases by heating.

7. A process for fabricating a circuit-like metallic foil sheet as claimed in claim 1, wherein the metallic foil is a 3 to 150 μ

m thick foil of a metal such as aluminum, copper, or stainless steel.

8. A process for fabricating a circuit-like metallic foil sheet as claimed in claim 1, wherein the metallic foil is a 10 to 60 μ

m thick foil of a metal such as aluminum, copper foil, or stainless steel.

9. A process for fabricating a circuit-like metallic foil sheet as claimed in claim 1, wherein the support is a dielectric.

10. A sheet comprising a circuit-like metallic foil obtained according to a process as claimed in claim 1.

11. A process for fabricating a resonant tag using a dielectric plastic film or a dieletric resin film as the support, said process comprising forming a resonant circuit on both sides of the support by transferring a circuit-like metallic foil according to a process as claimed in claim 1.

12. A process for fabricating a resonant tag as claimed in claim 11, wherein, the support is a dielectric plastic film or a dielectric resin film provided previously thereto a hole or a notch at a predetermined position for connecting the metallic foil circuits that are to be provided on both the surface and the back of the support.

14. A process for fabricating a resonant tag as claimed in claim 13, wherein a second laminate comprising a thermal adhesive dielectric resin film formed on the surface of the metal foil is used.

15. A resonant tag fabricated according to a process as claimed in claim 11.

17. A resonant tag as claimed in claim 16, wherein the dielectric resin film is provided on one side of the metallic foil and in the same shape as that of the circuit-like metallic foil.

18. A resonant tag as claimed in claim 17, wherein the dielectric resin film is laminated on one side of the metallic foil and has an area corresponding to that of a shape defined by the outer periphery of the circuit-like metallic foil.

19. A resonant tag as claimed in claim 16, wherein the dielectric resin film is made of an adhesive resin.

23. A method for deactivating resonant frequency characteristics of the resonant tag as claimed in claim 16, wherein a short-circuit is caused to generate at a portion such as a bent portion of a coil circuit which is electrically weak so as to destroy a resonant circuit, by sending strong resonant frequencies to the resonant circuit.

4. A process for fabricating a circuit-like metallic foil sheet, said processing comprising:

providing a predetermined circuit-like pattern on a metallic foil of a first laminate comprising a carrier sheet adhered thereto the metallic foil, by means of patterning using a stamping die;

superposing on said patterned first laminate, a second laminate comprising a carrier sheet adhered thereto a metallic sheet being patterned by means of patterning using a stamping die; and

heating said circuit-like patterned portions form the carrier sheet side of either or both of the first and the second laminates, thereby forming circuit-like metallic foils on both sides of said support with hot-melt adhesive films being interposed therebetween.

13. A process for fabricating a resonant tag, comprising:

providing, by means of patterning using a stamping die, a predetermined circuit-like pattern on a metallic foil of a first laminate comprising a carrier sheet adhered thereto the metallic foil and having further thereon a hot-melt adhesive dielectric resin film;

superposing on said patterned first laminate, a second laminate comprising a carrier sheet adhered thereto a metallic sheet being patterned by means of patterning using a stamping die; and

heating said circuit-like patterned portions from the carrier sheet side of either or both of the first and the second laminates, thereby forming circuit-like metallic foils on both sides of said support with hot-melt adhesive dielectric resin films interposed therebetween.

16. A resonant tag comprising a circuit-like metallic foil being adhered to either or both sides of a dielectric film prepared from a liquid resin by a coating process.

20. A resonant tag comprising two or more laminates of circuit-like metallic foils having on at least one side thereof a dielectric resin film prepared from a liquid resin by a coating process, said metallic foils being laminated using the dielectric resin coating as an adhesive.

21. A resonant tag in which an adhesion adhesive is coated on at least one face of a resonant tag base and a release paper is applied on the upper face of the adhesive-coated base, the resonant tag characterized in that the adhesion adhesive is coated in such a manner that noncoated portion of the adhesion adhesive is provided at appropriate width.

22. A resonant tag claimed in claim 21, wherein the noncoated portion is in a linear shape or a lattice shape.

24. A method for deactivating resonant frequency characteristics as claimed in claim 23, wherein the resonant tag is a tag in which the coil circuits of the resonant circuit are in correspondence with each other and laminated to a dielectric film so that the coil circuits sandwich the dielectric film.