Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
First Claim
Patent Images
1. A crystalline substrate based device comprising:
- a crystalline substrate having formed thereon a microstructure; and
at least one packaging layer which is sealed over said microstructure by means of an adhesive and defines therewith at least one gap between said crystalline substrate and said at least one packaging layer.
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Abstract
This invention discloses a crystalline substrate based device including a crystalline substrate having formed thereon a microstructure; and at least one packaging layer which is sealed over the microstructure by means of an adhesive and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer.
A method of producing a crystalline substrate based device is also disclosed.
92 Citations
37 Claims
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1. A crystalline substrate based device comprising:
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a crystalline substrate having formed thereon a microstructure; and
at least one packaging layer which is sealed over said microstructure by means of an adhesive and defines therewith at least one gap between said crystalline substrate and said at least one packaging layer. - View Dependent Claims (2, 3, 4, 6, 7, 8, 9, 10, 20, 31, 32, 33, 36)
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11. A chip scale packaged crystalline substrate comprising:
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a substrate having formed thereon a microstructure; and
at least one chip scale package which is sealed over said microstructure and defines therewith at least one gap. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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21. A method of producing a crystalline substrate based device comprising:
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providing a microstructure on a substrate; and
adhesively sealing at least one packaging layer over said microstructure and at least partially spaced therefrom, thereby to define a gap between said microstructure and said at least one packaging layer. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 34, 35, 37)
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Specification