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Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby

  • US 20020027296A1
  • Filed: 08/07/2001
  • Published: 03/07/2002
  • Est. Priority Date: 12/10/1999
  • Status: Active Grant
First Claim
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1. A crystalline substrate based device comprising:

  • a crystalline substrate having formed thereon a microstructure; and

    at least one packaging layer which is sealed over said microstructure by means of an adhesive and defines therewith at least one gap between said crystalline substrate and said at least one packaging layer.

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