Mosfet with high dielectric constant gate insulator and minimum overlap capacitance
First Claim
1. A method of forming a MOSFET device having low overlap capacitance and a short channel length comprising the steps of:
- (a) providing a semiconductor structure having a film stack formed on a surface of a substrate, said film stack comprising at least a pad oxide layer formed on said surface of said substrate and a nitride layer formed on said pad oxide layer;
(b) forming a gate hole in said nitride layer stopping on said pad oxide layer;
(c) forming an oxide layer on said nitride layer in said gate hole;
(d) etching said oxide layer and a portion of said pad oxide layer so as to provide an opening in said gate hole exposing said substrate, wherein the pad oxide layer is tapered by said etching;
(e) forming a high-k, high-temperature metal oxide layer about said gate hole and on said exposed substrate;
(f) filling said gate hole with gate conductor;
(g) removing said nitride layer exposing portions of said high k, high-temperature metal oxide; and
(h) completing fabrication of said MOSFET device.
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Abstract
Methods of fabricating metal oxide semiconductor field effect transistor (MOSFET) devices having a high dielectric constant (k greater than 7) gate insulator, low overlap capacitance (0.35 fF/μm or below) and a channel length (sub-lithographic, e.g., 0.1 μm or less) that is shorter than the lithography-defined gate lengths are provided. The methods include a damascene processing step and a chemical oxide removal (COR) step. The COR step produces a large taper on a pad oxide layer which, when combined with a high-k gate insulator, results in low overlap capacitance, sort channel lengths and better device performance as compared to MOSFET devices that are formed using conventional Complementary Metal Oxide Semiconductor (CMOS) technologies.
64 Citations
32 Claims
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1. A method of forming a MOSFET device having low overlap capacitance and a short channel length comprising the steps of:
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(a) providing a semiconductor structure having a film stack formed on a surface of a substrate, said film stack comprising at least a pad oxide layer formed on said surface of said substrate and a nitride layer formed on said pad oxide layer;
(b) forming a gate hole in said nitride layer stopping on said pad oxide layer;
(c) forming an oxide layer on said nitride layer in said gate hole;
(d) etching said oxide layer and a portion of said pad oxide layer so as to provide an opening in said gate hole exposing said substrate, wherein the pad oxide layer is tapered by said etching;
(e) forming a high-k, high-temperature metal oxide layer about said gate hole and on said exposed substrate;
(f) filling said gate hole with gate conductor;
(g) removing said nitride layer exposing portions of said high k, high-temperature metal oxide; and
(h) completing fabrication of said MOSFET device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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16. A method of forming a MOSFET device having low overlap capacitance and a short channel length comprising the steps of:
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(i) providing a semiconductor structure having a dummy film stack formed on a surface of a substrate, said dummy film stack comprising at least a pad oxide layer formed on said surface of said substrate, a polysilicon layer on said pad oxide layer, and a SiO2 layer formed on said polysilicon layer;
(ii) removing selective portions of said dummy film stack stopping on said pad oxide layer so as to provide a patterned dummy gate region;
(iii) removing said SiO2 layer from said patterned dummy gate region;
(iv) forming activated source/drain extensions in said substrate beneath said dummy gate region;
(v) forming spacers on sidewalls of said dummy gate region;
(vi) forming activated source/drain regions in said substrate;
(vii) forming silicide regions in portions of said pad oxide layer and in said polysilicon layer of said dummy gate region;
(viii) forming an insulator layer surrounding said dummy gate region;
(ix) planarizing said insulator layer stopping at said polysilicon layer in said dummy gate region;
(x) forming an opening so as to expose a portion of said substrate, said opening being formed by removing said polysilicon layer of said dummy gate and by tapering a portion of said pad oxide layer of said dummy gate;
(xi) forming a high-k, low-temperature metal oxide in said opening; and
(xii) filling said opening with a gate conductor deposited at low temperatures
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32. A MOSFET device comprising at least one gate region formed on a semiconductor substrate, said gate region comprising a gate conductor, a gate insulator and spacers, said gate insulator is a high-k metal oxide having a dielectric constant of greater than 7.0, said gate region further comprising a sub-lithographic channel formed beneath said gate insulator, wherein said channel length is determined by forming a portion of said gate insulator on a tapered pad oxide layer.
Specification