Method for assembling integral type electronic component and integral type electronic component

• US 20020028595A1
• Filed: 08/29/2001
• Published: 03/07/2002
• Est. Priority Date: 08/29/2000
• Status: Active Grant

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Higashi, Kazushi, Otani, Hiroyuki, Tsukahara, Norihito
• Granted Patent: US 6,825,055 B2
• Time in Patent Office: Days
• US Class Current: 439/329
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/145 Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
• CPC Class Codes: H05K 13/0482 using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
• CPC Class Codes: H05K 7/1061 co-operating by abutting

Abstract

An integral type electronic component is formed of a first board and a second board by storing and holding electronic components to component storage parts of the first board and electrically connecting the second board to the electronic components. An arrangement accuracy of the electronic components is determined on the basis of an arrangement accuracy of the component storage parts, and the electronic components stored in the component storage parts are limited in motion. The electronic components can be arranged highly accurately and simply at low costs in a short time in comparison with the conventional art by being simply inserted to the component storage parts.

Claims

1. A method for assembling an integral type electronic component, which comprises:

storing and holding an electronic component to a component storage part of a first board; and

electrically connecting a second board to the electronic component held to the first board, thereby forming the integral type electronic component of the first board and the second board.

2. The method for assembling the integral type electronic component according to claim 1, wherein bumps of the second board are flattened before the second board is electrically connected to the electronic component after the electronic component is held to the first board.

3. An integral type electronic component which comprises:

a first board with a component storage part for storing and holding an electronic component; and

a second board which is electrically connected to the electronic component held to the first board, thereby being united with the first board.

4. The integral type electronic component according to claim 3, wherein the component storage part has a side wall for shielding light of a light-emitting element when the electronic component is the light-emitting element.

5. The integral type electronic component according to claim 3, wherein the first board is formed of any one of glass, ceramic and an organic resin.

6. The integral type electronic component according to claim 4, wherein the first board is formed of any one of glass, ceramic and an organic resin.

7. The integral type electronic component according to claim 3, wherein the electronic component is held to the component storage part with a photo-curing type insulating resin.

8. The integral type electronic component according to claim 4, wherein the electronic component is held to the component storage part with a photo-curing type insulating resin.

9. The integral type electronic component according to claim 5, wherein the electronic component is held to the component storage part with a photo-curing type insulating resin.

10. The integral type electronic component according to claim 6, wherein the electronic component is held to the component storage part with a photo-curing type insulating resin.