×

Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials

  • US 20020028599A1
  • Filed: 08/22/2001
  • Published: 03/07/2002
  • Est. Priority Date: 05/19/2000
  • Status: Active Grant
First Claim
Patent Images

1. A method for securing at least two semiconductor device components to one another, comprising:

  • providing a first semiconductor device component;

    applying an adhesive material comprising a pressure sensitive component and a thermoset component to a surface of said first semiconductor component;

    pressing a second semiconductor device component against said adhesive material to secure said second semiconductor device component to said first semiconductor device component with at least said pressure sensitive component of said adhesive material; and

    heating at least said thermoset component of said adhesive material to cure at least said thermoset component.

View all claims
  • 7 Assignments
Timeline View
Assignment View
    ×
    ×