Chip type light emitting diode and methodof manufacture thereof
First Claim
1. A chip type light emitting diode comprising:
- a base portion;
a body portion extending from said base portion;
a light emitting portion provided on said body portion; and
a resin sealant block for sealing said light emitting portion.
1 Assignment
0 Petitions
Accused Products
Abstract
A chip type light emitting diode and a method of manufacture thereof are disclosed. The chip type light emitting diode can be mounted together with other electronic components on a mother board in the same process at one time and which is very useful as a light source for a liquid crystal backlight.
The chip type light emitting diode has a base portion mounted to one surface side of the mother board, a body portion extending from the base portion and adapted to pass through a hole in the mother board, and a light emitting portion provided on the body portion to emit light on the other surface side of the mother board. The base portion is provided with a pair of external connection electrodes electrically connected to the light emitting portion. The light emitting portion is sealed with a resin sealant block. In one example, when the base portion is mounted to the back surface side of the mother board, the light emitting portion is so arranged that its light emitting direction matches the light conduction direction of the liquid crystal backlight arranged on the mother board.
The method of manufacturing a chip type light emitting diode performs a plurality of steps to form a plurality of chip type light emitting diodes on a single collective circuit board and a final step of dividing the collective circuit board into individual chip type light emitting diodes.
25 Citations
9 Claims
-
1. A chip type light emitting diode comprising:
-
a base portion;
a body portion extending from said base portion;
a light emitting portion provided on said body portion; and
a resin sealant block for sealing said light emitting portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A method of manufacturing a chip type light emitting diode comprising:
-
a step of forming a number of rectangular holes in a collective circuit board in columns and rows at equal intervals, forming through-holes on inner circumferential surfaces of said rectangular holes, and providing between the plurality of holes a plurality of base portions, body portions vertically extending one from each of said base portions, external connection electrodes formed on said base portions, and first and second electrode portions formed on said body portions;
a step of arranging light emitting portions on said first electrode portions and connecting said light emitting portions and said second electrode portions by bonding wires;
a step of putting on said collective circuit board a mold formed with recesses to accommodate said light emitting portions and bonding wires in such a manner that said recesses match said light emitting portions and said bonding wires and sealing said light emitting portions and said bonding wires by filling a resin into said recesses; and
a step of, after removing said mold, cutting said collective circuit board in column and row directions to form chip type light emitting diodes each comprising said base portion having said external connection electrodes and said body portion having said first and second electrode portions and said light emitting portion.
-
Specification