Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module

• US 20020036890A1
• Filed: 09/19/2001
• Published: 03/28/2002
• Est. Priority Date: 09/25/2000
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Furuya, Keizo
• Granted Patent: US 6,504,720 B2
• Time in Patent Office: Days
• US Class Current: 361/702
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0241 the tubes being flexible
• CPC Class Codes: F28D 2015/0291 comprising internal rotor means, e.g. turbine driven by the working fluid
• CPC Class Codes: F28F 2250/08 Fluid driving means, e.g. pumps, fans
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A cooling unit has a vessel that is filled with a refrigerant. The vessel includes a heat receiving portion for receiving heat from a heat generating component, a heat dissipating portion for dissipating the heat from the heat generating component, and a heat transfer portion for transferring the heat transmitted to the heat receiving portion to the heat dissipating portion via a refrigerant. At least the heat receiving portion of the vessel is formed of a soft heat conduction sheet that receives the heat from the heat generating component. The heat conduction sheet is directly in contact with the heat generating component.

Claims

1. A cooling unit for cooling a heat generating component, comprising:

a vessel filled with a refrigerant, the vessel including a heat receiving portion for receiving heat from the heat generating component, a heat dissipating portion for dissipating the heat from the heat generating component, and a heat transfer portion for transferring the heat from the heat generating component, transmitted to the heat receiving portion, to the heat dissipating portion via the refrigerant,

that part of at least the heat receiving portion of the vessel which receives the heat from the heat generating component being formed of a soft heat conduction sheet capable of elastic deformation, the heat conduction sheet being directly in contact with the heat generating component.

2. A cooling unit according to claim 1, wherein said vessel has a groove-shaped recess connecting the heat receiving portion and the heat dissipating portion, and said heat conduction sheet covers an open end of the recess and defines a refrigerant passage for the refrigerant in conjunction with the recess.

3. A cooling unit according to claim 1, wherein said heat receiving portion includes at least one projection projecting toward the heat conduction sheet, the distal end of the projection being in contact with the heat conduction sheet.

4. A cooling unit according to claim 1, further comprising a heat sink connected thermally to the heat dissipating portion.

5. A cooling unit according to claim 4, wherein that part of said heat dissipating portion which is connected thermally to the heat sink is formed of the heat conduction sheet.

6. A cooling unit for cooling a heat generating component, comprising:

a heat receiving portion for receiving heat from the heat generating component;

a heat dissipating portion for dissipating the heat from the heat generating component; and

a heat transfer portion for circulating a refrigerant between the heat receiving portion and the heat dissipating portion and transferring the heat from the heat generating component, transmitted to the heat receiving portion, to the heat dissipating portion via the refrigerant,

that part of at least the heat receiving portion which receives the heat from the heat generating component being formed of a soft heat conduction member capable of elastic deformation, the heat conduction member being directly in contact with the heat generating component.

7. A cooling unit according to claim 6, wherein said heat transfer portion includes a first pipeline for guiding the refrigerant heated in the heat receiving portion to the heat dissipating portion, a second pipeline for guiding the refrigerant cooled by heat exchange in the heat dissipating portion to the heat receiving portion, and a pump for automatically circulating the refrigerant between the heat receiving portion and the heat dissipating portion.

8. A cooling unit according to claim 6, further comprising a heat sink connected thermally to the heat dissipating portion.

9. A cooling unit for cooling a heat generating component, comprising:

a main body having heat conductivity, the main body including a heat receiving portion for receiving heat from the heat generating component and a heat dissipating portion connected thermally to the heat receiving portion;

a fan for supplying cooling air to the heat dissipating portion; and

a refrigerant passage in the main body for moving a liquid refrigerant between the heat receiving portion and the heat dissipating portion, the refrigerant passage being capable of transferring the heat from the heat generating component, transmitted to the heat receiving portion, to the heat dissipating portion via the refrigerant, that part of the refrigerant passage which corresponds to the heat receiving portion being formed of a soft heat conduction sheet capable of elastic deformation, the heat conduction sheet being connected thermally to the heat generating component.

10. A cooling unit according to claim 9, wherein said main body has a cooling air passage for the cooling air connected thermally to the refrigerant passage.

11. A circuit module comprising:

a circuit board having a mounting surface;

a heat generating component mounted on the mounting surface of the circuit board; and

a cooling unit for cooling the heat generating component, the cooling unit including a heat receiving portion for receiving heat from the heat generating component, a heat dissipating portion for dissipating the heat from the heat generating component, and a heat transfer portion for transferring the heat from the heat generating component, transmitted to the heat receiving portion, to the heat dissipating portion via a refrigerant, that part of at least the heat receiving portion of the cooling unit which receives the heat from the heat generating component being formed of a soft heat conduction sheet capable of elastic deformation, the heat conduction sheet having an outer peripheral portion projecting around the heat generating component, the outer peripheral portion being directly in contact with the mounting surface of the circuit board.

12. A circuit module according to claim 11, wherein said heat receiving portion of said cooling unit is fixed to the circuit board by means of a bracket so that the heat conduction sheet of the heat receiving portion is pressed against the heat generating component and the mounting surface of the circuit board.

14. A circuit module according to claim 13, wherein said heat receiving portion of said cooling unit is fixed to the heat generating component by means of a bracket so that the heat conduction pouch is flattened between the bracket and the heat generating component and adheres to the heat generating component.

15. A circuit module according to claim 13, wherein said cooling unit includes a heat sink connected thermally to the heat dissipating portion.

16. A circuit module according to claim 15, wherein said heat dissipating portion of said cooling unit is formed of a soft heat conduction pouch capable of elastic deformation and having a socket at one end thereof to which the pipeline is connected, the heat conduction pouch being directly in contact with the heat sink.

18. An electronic apparatus according to claim 17, wherein said cooling unit includes a heat sink connected thermally to the heat dissipating portion.

19. An electronic apparatus according to claim 18, wherein that part of said heat dissipating portion which is connected thermally to the heat sink is formed of the heat conduction sheet.

13. A circuit module comprising:

a heat generating component; and

a cooling unit for cooling the heat generating component, the cooling unit including a heat receiving portion for receiving heat from the heat generating component, a heat dissipating portion for dissipating the heat from the heat generating component, and a pipeline for transferring the heat from the heat generating component, transmitted to the heat receiving portion, to the heat dissipating portion via a refrigerant, the heat receiving portion of the cooling unit being formed of a soft heat conduction pouch capable of elastic deformation and having a socket at one end thereof to which the pipeline is connected, the heat conduction pouch being directly in contact with the heat generating component.

17. An electronic apparatus comprising:

a housing having a heat generating component therein; and

a cooling unit held in the housing, the cooling unit including a heat receiving portion for receiving heat from the heat generating component, a heat dissipating portion for dissipating the heat from the heat generating component, and a heat transfer portion for transferring the heat from the heat generating component, transmitted to the heat receiving portion, to the heat dissipating portion via a refrigerant, that part of at least the heat receiving portion of the cooling unit which receives the heat from the heat generating component being formed of a soft heat conduction sheet capable of elastic deformation, the heat conduction sheet being directly in contact with the heat generating component.