Light emitting diode

• US 20020039002A1
• Filed: 09/17/2001
• Published: 04/04/2002
• Est. Priority Date: 09/29/2000
• Status: Active Grant

• Current Assignee: Citizen Electronics Company Limited
• Original Assignee: Citizen Electronics Company Limited
• Inventors: Fukasawa, Koichi, Ishii, Hirohiko
• Granted Patent: US 6,744,194 B2
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/502 Wavelength conversion materials

Abstract

A light emitting diode is disclosed which is small and inexpensive and can emit a variety of intermediate colors of light with a single light emitting element chip and whose current consumption is small. This invention provides a light emitting diode which comprises: a substrate; electrodes formed on the substrate; a light emitting element chip connected to the electrodes and mounted on an upper surface of the substrate; a resin material sealing an upper surface side of the light emitting element chip; and fluorescent particles and coloring particles scatteringly distributed in the resin material. The coloring particles absorb a part of wavelengths of light from the light emitting element chip and a part of wavelengths of light that have been changed by the fluorescent particles.

Claims

1. A light emitting diode comprising:

a substrate;

a light emitting element chip mounted on said substrate;

a wavelength conversion material to receive light from said light emitting element chip and change wavelengths of the received light; and

a wavelength absorbing material to receive the light from said light emitting element chip and said wavelength conversion material and absorb a part of the wavelengths of the received light.

2. A light emitting diode according to claim 1, wherein said wavelength conversion material is fluorescent particles and said wavelength absorbing material is coloring particles.

3. A light emitting diode according to claim 1, wherein said wavelength conversion material and said wavelength absorbing material are scatteringly distributed in a cover member enclosing said light emitting element chip.

4. A light emitting diode according to claim 3, wherein said cover member is made from a light transmitting resin material.

5. A light emitting diode comprising:

a substrate;

electrodes formed on said substrate;

a light emitting element chip connected to said electrodes and mounted on an upper surface of said substrate;

a resin material for sealing an upper surface side of said light emitting element chip; and

fluorescent particles and coloring particles contained in said resin material.

6. A light emitting diode according to claim 5, wherein said fluorescent particles are made from yttrium aluminum garnet (YAG).

7. A light emitting diode according to claim 5, wherein said coloring particles are made from a dye which absorbs a part of wavelengths of light from said light emitting element chip and a part of wavelengths of light that have been changed by said fluorescent particles.

8. A light emitting diode according to claim 5, wherein said light emitting element chip is a blue light emitting diode element made from a gallium nitride compound semiconductor.