×

Miniature Microdevice Package and Process for Making Thereof

  • US 20020043706A1
  • Filed: 06/25/2001
  • Published: 04/18/2002
  • Est. Priority Date: 06/28/2000
  • Status: Active Grant
First Claim
Patent Images

1. A miniature microdevice package comprising:

  • a miniature frame substrate made of a material selected from the group including;

    ceramic, metal and a combination of ceramic and metal, the miniature frame substrate having a spacer delimiting a hollow; and

    a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice, the microdevice die being mounted on the spacer to form a chamber, the microdevice being located within the chamber, the bonding pads being located outside of the chamber.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×