Miniature Microdevice Package and Process for Making Thereof

• US 20020043706A1
• Filed: 06/25/2001
• Published: 04/18/2002
• Est. Priority Date: 06/28/2000
• Status: Active Grant

• Current Assignee: Institut national d'optique
• Original Assignee: Institut national d'optique
• Inventors: Jerominek, Hubert, Alain, Christine
• Granted Patent: US 6,686,653 B2
• Time in Patent Office: Days
• US Class Current: 257/680
• CPC Class Codes: B81B 7/0077 Other packages not provided for in groups B81B7/0035 - B81B7/0074
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45599 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01032 Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01327 : Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/2075 : larger or equal to 1 micron less than 10 microns
• CPC Class Codes: H01L 2924/20751 : larger or equal to 10 microns less than 20 microns
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

The present invention is concerned with a miniature microdevice package and a process of making thereof. The package has a miniature frame substrate made of a material selected from the group including: ceramic, metal and a combination of ceramic and metal. The miniature frame substrate has a spacer delimiting a hollow. The package also includes a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice. The microdevice die is mounted on the spacer to form a chamber. The microdevice is located within the chamber. The bonding pads are located outside of the chamber.

Claims

1. A miniature microdevice package comprising:

a miniature frame substrate made of a material selected from the group including;

ceramic, metal and a combination of ceramic and metal, the miniature frame substrate having a spacer delimiting a hollow; and

a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice, the microdevice die being mounted on the spacer to form a chamber, the microdevice being located within the chamber, the bonding pads being located outside of the chamber.

2. A miniature microdevice package according to claim 1, wherein the miniature frame substrate is shaped to form a channel for pumping air out of the chamber, the package further comprising a plug for sealing the channel.

3. A miniature microdevice package according to claim 1, wherein the miniature frame substrate has a recess in which the spacer is located, for receiving the microdevice die.

4. A miniature microdevice package according to claim 1, wherein the miniature frame substrate is provided with a window for allowing radiation inside the chamber.

5. A miniature microdevice package according to claim 4, wherein the window is mounted in a recess provided in the miniature frame substrate.

6. A miniature microdevice package according to claim 1, wherein the microdevice substrate is soldered or glued on the spacer.

7. A miniature microdevice package according to claim 1, wherein the microdevice die comprises through-hole connectors for providing electric accesses to the bonding pads.

8. A miniature microdevice package according to claim 1, comprising:

electrical contacts integrated in the miniature frame substrate for providing electric accesses; and

solderable layers for electrically connecting the bonding pads of the microdevice die to the electrical contacts.

9. A miniature microdevice package comprising:

a miniature frame substrate made of a material selected from the group including;

ceramic, metal and a combination of ceramic and metal, the miniature frame substrate having a spacer delimiting a hollow;

a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice, the microdevice die being mounted on the spacer to form a chamber, the microdevice being located within the chamber, the bonding pads being located outside of the chamber, the miniature frame substrate being shaped to form a channel for pumping air out of the chamber, the miniature frame substrate being provided with a window for allowing radiation inside the chamber, the window being mounted in a recess provided in the miniature frame substrate; and

a plug for sealing the channel.

10. A miniature microdevice package comprising:

a miniature frame substrate made of a material selected from the group including;

ceramic, metal and a combination of ceramic and metal, the miniature frame substrate having a spacer delimiting a hollow; and

a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice, the microdevice die being mounted on the spacer to form a chamber, the microdevice being located within the chamber, the bonding pads being located outside of the chamber, the miniature frame substrate having a recess in which the spacer is located, for receiving the microdevice die, the microdevice substrate being soldered on the spacer;

electrical contacts being integrated in the miniature frame substrate for providing electric accesses; and

solderable layers for electrically connecting the bonding pads of the microdevice die to the electrical contacts.

11. A process for making a miniature microdevice package, comprising steps of:

(a) shaping a spacer in a miniature frame substrate made of a material selected from the group including;

ceramic, metal and a combination of ceramic and metal;

(b) providing a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice; and

(c) mounting the microdevice die on the spacer to form a chamber, the microdevice being located within the chamber, the bonding pads being located outside of the chamber.

12. A process according to claim 11, further comprising steps of:

(d) shaping the miniature frame substrate to form a channel for pumping air out of the chamber;

(e) pumping air out of the chamber through the channel to produce a vacuum within the chamber; and

(f) after step (e), hermetically sealing the channel.

13. A process according to claim 12, wherein the shaping of step (d) is performed during step (a).

14. A process according to claim 12, wherein the shaping of step (a) further comprises a step of shaping a recess in the miniature frame substrate for receiving the microdevice die.

15. A process according to claim 12, wherein the shaping of step (a) further comprises a step of shaping an opening for the chamber through the miniature frame substrate, the process further comprises, before step (e), a step of soldering a window on the miniature frame substrate for blocking the opening and allowing radiation inside the chamber.

16. A process according to claim 15, wherein the shaping of step (a) further comprises a step of shaping a recess in the miniature frame substrate for receiving the window.

18. A process according to claim 17, further comprising steps of:

(e) shaping the miniature frame substrate to form channels for pumping air out of the chambers;

(f) pumping air out of the chambers through the channels to produce a vacuum within the chambers; and

(g) after step (f), hermetically sealing the channels.

20. A process according to claim 19, further comprising steps of:

(e) shaping the miniature frame substrate to form channels for pumping air out of the chambers;

(f) pumping air out of the chambers through the channels to produce a vacuum within the chambers; and

(g) after step (f), hermetically sealing the channels.

17. A process for making miniature microdevice packages, comprising steps of:

(a) shaping spacers in a miniature frame substrate made of a material selected from the group including;

ceramic, metal and a combination of ceramic and metal;

(b) providing microdevice dies each having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice;

(c) mounting the microdevice dies respectively on the spacers to form chambers, the microdevices being respectively located within the chambers, the bonding pads being located outside of the chambers; and

(d) sawing the miniature frame substrate to obtain the miniature microdevice packages.

19. A process for making miniature microdevice packages, comprising steps of:

(a) shaping spacers in a miniature frame substrate made of a material selected from the group including;

ceramic, metal and a combination of ceramic and metal;

(b) providing microdevice dies having a common microdevice substrate, each of the microdevice dies having a microdevice integrated on the common microdevice substrate, bonding pads integrated on the common microdevice substrate, and electrical conductors integrated in the common microdevice substrate for electrically connecting the bonding pads with the microdevice;

(c) mounting the common microdevice substrate with the microdevice dies respectively on the spacers to form chambers, the microdevices being respectively located within the chambers, the bonding pads being located outside of the chambers; and

(d) sawing the miniature frame and microdevice substrates to obtain the miniature microdevice packages.