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Polyimide film, method of manufacture , and metal interconnect board with Polyimide film substrate

  • US 20020045033A1
  • Filed: 08/09/2001
  • Published: 04/18/2002
  • Est. Priority Date: 08/24/2000
  • Status: Active Grant
First Claim
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1. A polyimide film made from a polyamic acid prepared from a tetracarboxylic dianhydride comprising pyromellitic dianhydride in combination with phenylenediamine, methylenedianiline and 3,4′

  • -oxydianiline such as to satisfy conditions (1-a) to (1-c) below;

    10 mol %≦

    X≦

    60 mol % 



    (1-a)20 mol %≦

    Y≦

    80 mol % 



    (1-b)10 mol %≦

    Z≦

    70 mol % 



    (1-c)wherein X is the mole percent of phenylenediamine, Y is the mole percent of methylenedianiline, and Z is the mole percent of 3,4′

    -oxydianiline, each based on the total amount of diamine, and further wherein the tetracarboxylic dianhydride and total diamine are in a molar ratio of about 0.9 to 1.1.

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