Substrate cleaning apparatus and substrate polishing apparatus with substrate cleaning apparatus

• US 20020045413A1
• Filed: 07/27/2001
• Published: 04/18/2002
• Est. Priority Date: 07/28/2000
• Status: Active Grant

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: Sotozaki, Hiroshi
• Granted Patent: US 6,616,512 B2
• Time in Patent Office: Days
• US Class Current: 451/65
• CPC Class Codes: B24B 37/345 Feeding, loading or unloading work specially adapted to lapping
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles

Abstract

A substrate cleaning apparatus is provided which comprises a box in which a substrate is cleaned with a cleaning liquid, and an exhaust system for exhausting the box, wherein the box is provided in its upper wall with an air intake opening and the exhaust system is fluidly connected to the box at a lower wall of the box so that air is introduced into the box through the air intake opening, flows down in the box passing around the substrate and finally exit the box through the exhaust system. A door is provided to close the air intake opening when an inside air pressure in the box becomes greater than an outside air pressure outside the box.

Claims

1. A substrate cleaning apparatus comprising:

a box in which a substrate is cleaned with a cleaning liquid; and

an exhaust system for exhausting the box;

the box having an air intake opening for introducing air into the box to create an air flow passing around the substrate in the box and thereafter entering the exhaust system and a door operable to close the air intake opening when an inside air pressure in the box becomes greater than an outside air pressure outside the box.

2. A substrate cleaning apparatus as set forth in claim 1, wherein the box includes an upper part and a lower part;

the air intake opening is provided at the upper part of the box; and

the exhaust system is fluidly connected to the box at the lower part of the box to create an air flow flowing down in the box.

3. A substrate cleaning apparatus as set forth in claim 2, wherein the box includes a top wall and a bottom wall;

the air intake opening is provided in the top wall; and

the exhaust system is fluidly connected to the box at the bottom wall.

4. A substrate cleaning apparatus as set forth in claim 3, wherein the door is pivotably supported such that the door is positioned under the action of its weight to close the air intake door and is pivoted to open the air intake opening under the influence of a difference between the inside air pressure and the outside air pressure when the former pressure becomes lower than the latter one.

5. A substrate cleaning apparatus as set forth in claim 1, further comprising a control for functioning to move the door to a position where the door closes the air intake opening or to a position where the door opens the air intake opening on the basis of a difference between the inside pressure and the outside pressure.

6. A substrate cleaning apparatus as set forth in claim 1, wherein the box is provided inside with a substrate rotating mechanism for rotating a substrate about its center axis, and at least one nozzle for supplying cleaning liquid to the substrate, while the substrate is rotated by the substrate rotating mechanism, to conduct a cleaning operation of the substrate, the substrate rotating mechanism being also operable to rotate the substrate at high speed after completion of the cleaning operation to dry the substrate.

7. A substrate cleaning apparatus comprising:

a box in which a substrate is cleaned with a cleaning liquid; and

an exhaust system for exhausting the box;

wherein the box is provided with an air intake opening for introducing air into the box to create an air flow passing around the substrate in the box and thereafter entering the exhaust system, and is provided inside with at least one water nozzle for discharging water to form a water barrier across the air intake opening for preventing the cleaning liquid in mist or gas form from dispersing outside the box through the air intake opening.

8. A substrate cleaning apparatus as set forth in claim 7, wherein the air intake opening has opposite side edges;

there are provided two water nozzles which extend along either side edge of the air intake opening and discharge water in the form of a sheet in such a manner that the water discharged from the water nozzles cross each other to form the barrier.

9. A substrate cleaning apparatus as set forth in claim 7, wherein a plurality of baffle plates are provided over the air intake opening to form a plurality of air passages which allow air to freely pass therethrough and check the water discharged from the water nozzle scattering outside the box through the air intake opening.

10. A substrate cleaning apparatus as set forth in claim 7, further comprising a control for operating the water nozzle to discharge water to form the barrier across the air intake opening when an air pressure in the box is greater than an air pressure outside the box or when the exhaust system is broken down.

11. A substrate cleaning apparatus as set forth in claim 7, wherein the box is provided inside with a substrate rotating mechanism for rotating a substrate about its center axis, and at least one nozzle for supplying cleaning liquid to the substrate, while the substrate is rotated by the substrate rotating mechanism, to conduct a cleaning operation of the substrate;

and the substrate rotating mechanism is also operable to rotate the substrate at high speed after completion of the cleaning operation of the substrate to dry the substrate.

13. A substrate cleaning apparatus as set forth in claim 12, wherein the box is provided inside with a substrate rotating mechanism for rotating a substrate about its center axis, and at least one nozzle for supplying cleaning liquid to the substrate, while the substrate is rotated by the substrate rotating mechanism, to conduct a cleaning operation of the substrate, the substrate rotating mechanism being also operable to rotate the substrate at high speed after completion of the cleaning operation of the substrate to dry the substrate.

15. A substrate cleaning apparatus as set forth in claim 14, wherein the box is provided inside with a substrate rotating mechanism for rotating a substrate about its center axis, and at least one nozzle for supplying cleaning liquid to the substrate, while the substrate is rotated by the substrate rotating mechanism, to conduct a cleaning operation of the substrate, the substrate rotating mechanism being also operable to rotate the substrate at high speed after completion of the cleaning operation of the substrate to dry the substrate.

12. A substrate polishing apparatus comprising:

a housing having a polishing chamber and a cleaning chamber;

the polishing chamber being provided inside with a turntable having a polishing surface and a substrate carrier for carrying a substrate to bring it into contact with the polishing surface of the turntable for polishing the substrate;

the cleaning chamber being provided with at least one cleaning apparatus comprising;

a box in which a substrate is cleaned with a cleaning liquid, and

an exhaust system for exhausting the box,

the box being provided with an air intake opening for introducing air into the box to create an air flow passing around the substrate in the box and thereafter entering the exhaust system and provided with a door operable to close the air intake opening when an inside air pressure in the box becomes greater than an outside air pressure outside the box.

14. A substrate polishing apparatus comprising:

a housing having a polishing chamber and a cleaning chamber;

the polishing chamber being provided inside with a turntable having a polishing surface and a substrate carrier for carrying a substrate to bring it into contact with the polishing surface of the turntable for polishing the substrate; and

the cleaning chamber being provided with at least one cleaning apparatus comprising;

a box in which a substrate is cleaned with a cleaning liquid, and

an exhaust system for exhausting the box,

wherein the box is provided with an air intake opening for introducing air into the box to create an air flow passing around the substrate in the box and thereafter entering the exhaust system, and is provided inside with a water nozzle for discharging water to form a water barrier across the air intake opening for preventing the cleaning liquid in mist or gas form from dispersing outside the box through the air intake opening