High performance magnetron for DC sputtering systems
First Claim
1. An apparatus for sputter deposition of material from a sputtering target onto a substrate, comprising:
- a first sputtering target having a perimeter, a front surface and a rear surface opposite the front surface;
a first set of one or more inner magnetic poles, each having the same polarity, mounted adjacent the rear surface;
a first set of one or more outer magnetic poles, each having a polarity opposite the polarity of the inner magnetic poles, mounted adjacent the rear surface juxtaposed to the perimeter of the first target, wherein the first set of outer magnetic poles collectively encircles the first set of inner magnetic poles; and
each one of the outer magnetic poles is magnetized at an acute magnetization angle relative to the front surface.
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Accused Products
Abstract
A sputter deposition apparatus and method includes perimeter magnets oriented an angle relative to the plane of the sputter target, either by magnetizing or by physically orienting the magnets at the chosen angle. The resulting magnetic flux extends radially outward, away from the central axis of the target, toward and beyond the target perimeter. This causes the return path of the flux to pass over the target surface more parallel to the plane of its sputtering surface. This spreads sputter erosion over a greater area of the target surface and mitigates development of sputtering grooves. Since target erosion is more uniform, more target material is used for sputter deposition, deterring waste. Each target can be used longer before the target material is penetrated, resulting in fewer target replacement cycles for a given volume of workpiece coating, raising the deposition chamber capacity factor.
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Citations
46 Claims
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1. An apparatus for sputter deposition of material from a sputtering target onto a substrate, comprising:
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a first sputtering target having a perimeter, a front surface and a rear surface opposite the front surface;
a first set of one or more inner magnetic poles, each having the same polarity, mounted adjacent the rear surface;
a first set of one or more outer magnetic poles, each having a polarity opposite the polarity of the inner magnetic poles, mounted adjacent the rear surface juxtaposed to the perimeter of the first target, wherein the first set of outer magnetic poles collectively encircles the first set of inner magnetic poles; and
each one of the outer magnetic poles is magnetized at an acute magnetization angle relative to the front surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 36, 37, 38, 39, 40, 41, 42)
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35. A method of sputter depositing material from a sputtering target onto a substrate, comprising the steps of:
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mounting within a vacuum chamber a first sputtering target having a perimeter, a front surface and a first rear surface opposite the front surface;
mounting a first set of one or more inner magnetic poles, each having the same polarity, adjacent the rear surface;
mounting a first set of one or more outer magnetic poles, each having a polarity opposite the polarity of the inner magnetic poles, adjacent the rear surface adjacent to the perimeter of the first target, wherein the first set of outer magnetic poles collectively encircles the first set of inner magnetic poles; and
each one of the outer magnetic poles is magnetized at an acute magnetization angle relative to the front surface; and
sputtering material from the first target onto the substrate.
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43. An apparatus for sputter deposition of material from a sputtering target onto a substrate, comprising:
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a first sputtering target having a first perimeter, a front surface facing generally downward and a rear surface opposite the front surface and facing generally upward;
a first set of one or more inner magnetic poles, each having the same polarity, mounted adjacent the rear surface;
a first set of one or more outer magnetic poles, each having a polarity opposite the polarity of the inner magnetic poles, mounted adjacent the rear surface and the first perimeter, wherein the first set of outer magnetic poles collectively encircles the first set of inner magnetic poles; and
each one of the outer magnetic poles is physically oriented at an orientation angle between thirty and sixty degrees relative to the first front surface, the orientation angle being directed radially outward and away from the first set of inner magnetic poles. - View Dependent Claims (44, 46)
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45. A method of sputter depositing material from a sputtering target onto a substrate, comprising the steps of
mounting within a vacuum chamber a first sputtering target having a first perimeter, a front surface facing generally downward and a rear surface opposite the front surface and facing generally upward; -
mounting a first set of one or more inner magnetic poles, each having the same polarity, adjacent the rear surface;
mounting a first set of one or more outer magnetic poles, each having a polarity opposite the polarity of the inner magnetic poles, adjacent the rear surface and the first perimeter, wherein the first set of outer magnetic poles collectively encircles the first set of inner magnetic poles; and
each one of the outer magnetic poles is physically oriented at an orientation angle between thirty and sixty degrees relative to the first front surface, the orientation angle being directed radially outward and away from the first set of inner magnetic poles; and
sputtering material from the first target onto the substrate.
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Specification