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Method for joining wafers at a low temperature and low stress

  • US 20020048900A1
  • Filed: 05/23/2001
  • Published: 04/25/2002
  • Est. Priority Date: 11/23/1999
  • Status: Abandoned Application
First Claim
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1. A method of joining two dissimilar materials together, comprising:

  • a) adding a reactive layer to a first material;

    b) adding a hydrophilic layer to a second material;

    c) joining said first and second materials together by placing said reactive layer in contact with said hydrophilic layer; and

    d) pressing said joined materials tightly for a period of time sufficient for strong bonds to form between said materials.

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