Guiding device for guiding conducting wire soldered on printed circuit board

• US 20020050907A1
• Filed: 04/27/2001
• Published: 05/02/2002
• Est. Priority Date: 10/30/2000
• Status: Active Grant

• Current Assignee: Delta Electronics Incorporated
• Original Assignee: Delta Electronics Incorporated
• Inventors: Wen-Hsiang, Lin, Szu-Lu, Huang
• Granted Patent: US 6,580,349 B2
• Time in Patent Office: Days
• US Class Current: 336/192
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: H05K 3/3426 characterised by the leads
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A guiding device is provided for guiding a conducting wire extended out from an electronic device to be soldered on a printed circuit board. The guiding device includes a base for supporting and fixing the conducting wire thereon, a first offset board connected to one end of the base for forming a space with an extending portion of the conducting wire when the conducting wire is fixed on the base and a second offset board connected to the other end of the base, which has a hole in a connection portion thereof for preventing the heat from being conducted to the printed circuit board when the conducting wire is soldered on the printed circuit board.

Claims

1. A guiding device for guiding a conducting wire extended out from an electronic device to be soldered on a printed circuit board, comprising:

a base for supporting said conducting wire thereon; and

plural of fixing elements protruding from the side edges of said base for fixing said conducting wire.

2. The guiding device according to claim 1, wherein said electronic device is a transformer.

3. The guiding device according to claim 1, wherein said conducting wire is a winding wire of said transformer.

4. The guiding device according to claim 1, wherein said guiding device further comprises a first offset board connected to one end of said base for forming a space with an extending portion of said conducting wire when said conducting wire is fixed on said base.

5. The guiding device according to claim 4, wherein said space is used for receiving solder to prevent said solder from flowing around said printed circuit board.

6. The guiding device according to claim 1, wherein said guiding device further comprises a second offset board connected to the other end of said base and having a hole formed on a connection portion thereof for preventing the heat from being conducted to said printed circuit board when said conducting wire is soldered to said printed circuit board.

7. A guiding device for guiding a conducting wire extended out from an electronic device to be soldered on a printed circuit board, comprising:

a base for supporting and fixing said conducting wire thereon;

a first offset board connected to one end of said base for forming a space with an extending portion of said conducting wire when said conducting wire is fixed on said base; and

a second offset board connected to the other end of said base and having a hole in a connection portion thereof for preventing the heat from being conducted to said printed circuit board when said conducting wire is soldered on said printed circuit board.

8. The guiding device according to claim 7, wherein said base comprises plural fixing elements protruding from the side edges thereof for fixing said conducting wire.

9. An electronic device adapted to be fixed on a printed circuit board, comprising:

a conducting wire collector for collecting a conducting wire;

a guiding device connected to said conducting wire collector for guiding said conducting wire extended out from said conducting wire collector to be soldered on said printed circuit board, wherein said guiding device comprises;

a base for supporting said conducting wire thereon; and

plural fixing elements protruding from the side edges of said base for fixing said conducting wire.

10. The electronic device according to claim 9, wherein said electronic device is a transformer.

11. The electronic device according to claim 10, wherein said conducting wire is a winding wire of said transformer.

12. The electronic device according to claim 9, wherein said guiding device further comprises a first offset board connected to one end of said base for forming a space with an extending portion of said conducting wire when said conducting wire is fixed on said base.

13. The electronic device according to claim 12, wherein said space is used for receiving solder to prevent said solder from flowing around said printed circuit board.

14. The electronic device according to claim 9, wherein said guiding device further comprises a second offset board having one end connected to said conducting wire collector and a hole formed on a connection portion thereof for preventing the heat from being conducted to said printed circuit board when said conducting wire is soldered to said printed circuit board.