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CIRCUIT ARRANGEMENT COMPRISING AN SMD-COMPONENT, IN PARTICULAR A TEMPERATURE SENSOR, AND A METHOD OF MANUFACTURING A TEMPERATURE SENSOR

  • US 20020050921A1
  • Filed: 08/24/1998
  • Published: 05/02/2002
  • Est. Priority Date: 08/23/1997
  • Status: Active Grant
First Claim
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1. A circuit arrangement comprising an SMD-component (1) having two electroconductive contacts (2a, 2b), which are each conductively connected to a conductor track (3a, 3b) provided on a substrate (4), characterized in that each of the contacts (2a, 2b) is made of a metal-glass layer (6) forming the connection to the conductor tracks (3a, 3b), and in that said metal-glass layer (6) is prepared by heating a glass particle-containing metal until melting or softening of said glass particles occurs.

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