CIRCUIT ARRANGEMENT COMPRISING AN SMD-COMPONENT, IN PARTICULAR A TEMPERATURE SENSOR, AND A METHOD OF MANUFACTURING A TEMPERATURE SENSOR

• US 20020050921A1
• Filed: 08/24/1998
• Published: 05/02/2002
• Est. Priority Date: 08/23/1997
• Status: Active Grant

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: SILLEN, VALERIE R.C.M.J., GROEN, WILHELM A.
• Granted Patent: US 6,515,572 B2
• Time in Patent Office: Days
• US Class Current: 338/309
• CPC Class Codes: G01K 7/22 the element being a non-linear resistance, e.g. thermistor G01K7/26 takes precedence
• CPC Class Codes: H01C 1/142 the terminals or tapping points being coated on the resistive element
• CPC Class Codes: H01C 7/043 Oxides or oxidic compounds
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2201/10984 Component carrying a connection agent, e.g. solder, adhesive
• CPC Class Codes: H05K 2203/1453 Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49082 Resistor making

Abstract

The invention relates to a circuit arrangement comprising an SMD-component (1), in particular a temperature sensor with a thermistor element (1), having two electroconductive contacts (2a, 2b), which are each conductively connected to a conductor track (3a, 3b) provided on a substrate (4). A firm, mechanical connection as well as a good electroconductive connection between the SMD-component and the conductor tracks is achieved in that the contacts (2a, 2b) are each made of a metal-glass layer (6) forming the connection to the conductor tracks (3a, 3b), and in that the metal-glass layer (6) is manufactured by heating a glass particle-containing metal until melting or softening of the glass particles occurs. The invention also relates to a method of manufacturing a temperature sensor and to a method of manufacturing such a connection.

Claims

1. A circuit arrangement comprising an SMD-component (1) having two electroconductive contacts (2a, 2b), which are each conductively connected to a conductor track (3a, 3b) provided on a substrate (4), characterized in that each of the contacts (2a, 2b) is made of a metal-glass layer (6) forming the connection to the conductor tracks (3a, 3b), and in that said metal-glass layer (6) is prepared by heating a glass particle-containing metal until melting or softening of said glass particles occurs.

2. A circuit arrangement as claimed in claim 1, characterized in that the contacts (2a, 2b) comprise silver, copper, gold, platinum or an alloy including such a material.

3. A circuit arrangement as claimed in claim 1, characterized in that the conductor tracks (3a, 3b) are composed of silver, copper, gold, platinum or an alloy including such a material.

4. A temperature sensor comprising a thermistor element (1) having two electroconductive contacts (2a, 2b) which are each conductively connected to a conductor track (3a, 3b) provided on a substrate (4), characterized in that each of the contacts (2a, 2b) is made of a metal-glass layer (6) forming the connection to the conductor tracks (3a, 3b), and in that said metal-glass layer (6) is prepared by heating a glass particle-containing metal until melting or softening of said glass particles occurs.

5. A temperature sensor as claimed in claim 4, characterized in that the thermistor element (1) is composed of a semiconductive ceramic material, particularly a mixed cyrstal oxide of the rare earth metals.

6. A temperature sensor as claimed in claim 4, characterized in that the thermistor element (1) and/or the contacts (2a, 2b) is/are covered with a layer composed of a glass and/or ceramic material.

9. The use of the temperature sensor, as claimed in claim 4, to measure high temperatures, particularly in the range between 500°

C. and 1100°

C., for example the exhaust-gas temperature or the catalytic-converter temperature of motor vehicles.

7. A method of manufacturing a temperature sensor, characterized in that, to form contacts (2a, 2b), a metal paste comprising glass particles is provided on two end faces of a thermistor element (1), each of said contacts (2a, 2b) being brought into contact with a conductor track (3a, 3b) provided on a substrate (4), and said contacts (2a, 2b) being heated until melting or softening of the glass particles takes place, and subsequently cooled.

8. A method of manufacturing an electroconductive connection between a contact (2a, 2b) of an SMD-component (1) and a conductor track (3a, 3b) on a substrate (4), characterized in that, to form said contact (2a, 2b), a metal paste comprising glass particles is provided on a surface of the SMD-component (1), which contact (2a, 2b) is brought into contact with the conductor track (3a, 3b) and said contact (2a, 2b) is heated until melting or softening of the glass particles occurs, and subsequently cooled.