Radiator for electronic parts, electronic device, electric circuit device, and computer

• US 20020051342A1
• Filed: 09/11/2001
• Published: 05/02/2002
• Est. Priority Date: 09/11/2000
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Kanada, Yoshihisa
• Granted Patent: US 6,552,906 B2
• Time in Patent Office: Days
• US Class Current: 361/705
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 2924/3511 Warping

Abstract

To prevent generation of air bubbles in thermal grease 37 when a wired board 24 is bent due to a difference of thermal expansibility between a CPU chip 31 and a heat sink 32 in a CPU package 21, the thermal grease 37 being filled between the CPU chip 31 and a plate member 34 of the heat sink 32. A through-hole 38 is formed almost in the center of a plate member 34 so as to go through the plate member 34.

Claims

1. A radiator for electronic parts, comprising:

a heat receiving surface for receiving heat from a heating generating element; and

a radiating element for radiating heat transferred from said heat receiving surface;

a first through-hole opened at one end to said heat receiving surface and opened at an opposite end;

wherein, in response to a heat conductive semifluid material being positioned between the heat generating element and said heat receiving surface, said heat conductive semifluid material is being driven up and down in said first through-hole in response to changes in temperature.

2. The radiator for electronic parts according to claim 1, wherein said radiator further comprises:

a plate member having said heat receiving surface; and

a second through-hole extended through said plate member in a direction substantially perpendicular to said heat receiving surface;

wherein, in response to a heat conductive semifluid material being positioned between the heat generating element and said heat receiving surface, said heat conductive semifluid material is being driven up and down in said second through-hole in response to changes in temperature.

3. An electronic device, comprising:

a heat generating element;

a radiator having a heat receiving surface for receiving heat from said heating generating element, a radiating element for radiating heat transferred from said heat receiving surface, and a first through-hole opened at one end to said heat receiving surface and opened at an opposite end; and

a heat conductive semifluid material being positioned between the heat generating element and said heat receiving surface, wherein said heat conductive semifluid material is driven up and down in said first through-hole in response to changes in temperature.

4. The electronic device of claim 3, wherein said radiator further comprises:

a plate member having said heat receiving surface; and

a second through-hole extended through said plate member in a direction substantially perpendicular to said heat receiving surface;

wherein, said heat conductive semifluid material is being driven up and down in said second through-hole in response to changes in temperature.