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Chip package with grease heat sink and method of making

  • US 20020052105A1
  • Filed: 12/28/2001
  • Published: 05/02/2002
  • Est. Priority Date: 08/31/1999
  • Status: Active Grant
First Claim
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1. A method of making an IC chip package having an IC chip with an active surface, the active surface having extending therefrom an electrical connector in electrical communication with IC chip, the IC chip being mounted upon a substrate, the method comprising:

  • providing a container disposed upon the substrate; and

    injecting a grease in contact with the active surface of the IC chip such that the grease is;

    enclosed by the container and the substrate; and

    is in contact with the active surface and the electrical connector.

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