Probe card assembly and kit, and methods of making same

• US 20020053734A1
• Filed: 12/27/2001
• Published: 05/09/2002
• Est. Priority Date: 11/16/1993
• Status: Abandoned Application

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Mathieu, Gaetan L., Eldridge, Benjamin N., Grube, Gary W., Khandros, Igor Y.
• Application Number:
  US10/034,528
• Publication Number:
  US 20020053734A1
• Time in Patent Office: Days
• US Class Current: 257/724
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: C25D 21/02 Heating or cooling
• CPC Class Codes: C25D 5/22 Electroplating combined with mechanical treatment during the deposition
• CPC Class Codes: C25D 5/605 Surface topography of the layers, e.g. rough, dendritic or nodular layers
• CPC Class Codes: C25D 7/123 Semiconductors first coated with a seed layer or a conductive layer
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/4889 Connection or disconnection of other leads to or from wire-like parts, e.g. wires
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/85201 : Compression bonding
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06527 : Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06555 : Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/12 : Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/72 : Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/068 : wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/1031 : Surface mounted metallic connector elements
• CPC Class Codes: H05K 2201/10318 : Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10757 : Bent leads
• CPC Class Codes: H05K 2201/10878 : Means for retention of a lead in a hole
• CPC Class Codes: H05K 2201/10909 : Materials of terminal, e.g. of leads or electrodes of components
• CPC Class Codes: H05K 2201/10946 : Leads attached onto leadless component after manufacturing the component
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/308 : Adaptations of leads connectors to printed circuits H01R12/00
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: H05K 3/3426 : characterised by the leads
• CPC Class Codes: H05K 3/368 : parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/4015 : using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49222 : forming array of contacts or terminals

Abstract

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer'"'"'s range of adjustment, by virtue of the interposer'"'"'s inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Claims

1. Space transformer for a probe card assembly, comprising:

a space transformer substrate having a top surface, a bottom surface, a first plurality of terminals disposed on the top surface, and a second plurality of terminals disposed on the bottom surface; and

a first plurality of resilient contact structures mounted directly to the first plurality of terminals.

2. Space transformer, according to claim 1, further comprising:

tip structures mounted to ends of the first plurality of resilient contact structures.

3. Space transformer, according to claim 1, wherein:

the first plurality of resilient contact structures are composite interconnection elements.

4. Space transformer, according to claim 1, wherein:

the first plurality of resilient contact structures are fabricated on a sacrificial substrate prior to mounting the first plurality of resilient contact structures directly to the first plurality of terminals.

5. Space transformer, according to claim 1, further comprising:

a second plurality of resilient contact structures mounted directly to the second plurality of terminals.

6. Space transformer, according to claim 1, wherein:

the second plurality of resilient contact structures are composite interconnection elements.

7. Space transformer, according to claim 1, wherein:

the second plurality of resilient contact structures are fabricated on a sacrificial substrate prior to mounting the second plurality of resilient contact structures directly to the second plurality of terminals.

8. Probe Card Assembly, comprising:

a probe card having a top surface, a bottom surface and a plurality of contact terminals on the top surface thereof;

an interposer having a top surface, a bottom surface, a first plurality of resilient contact structures extending from the bottom surface thereof and a second plurality of contact structures extending from the top surface thereof; and

a space transformer having a top surface, a bottom surface, a plurality of contact pads disposed on the bottom surface thereof, and a third plurality of resilient contact structures extending from the top surface thereof;

wherein;

the first plurality of resilient contact structures effect a pressure connection with the contact terminals of the probe card; and

the second plurality of resilient contact structures effect a pressure connection with the contact pads of the space transformer.

9. Probe Card Assembly, according to claim 8, wherein:

the third plurality of resilient contact structures are mounted directly to terminals on the top surface of the space transformer.

10. Probe Card Assembly, according to claim 8, wherein:

the first plurality of resilient contact structures are composite interconnection elements.

11. Probe Card Assembly, according to claim 8, wherein:

the second plurality of resilient contact structures are composite interconnection elements.

12. Probe Card Assembly, according to claim 8, wherein:

the third plurality of resilient contact structures are composite interconnection elements.

13. Probe Card Assembly, according to claim 8, wherein:

each one of the first plurality of resilient contact structures are at least two composite interconnection elements.

14. Probe Card Assembly, according to claim 8, wherein:

each one of the second plurality of resilient contact structures are at least two composite interconnection elements.

15. Probe Card Assembly, according to claim 8, further comprising:

a front mounting plate made of a rigid material, having a top surface and a bottom surface, and disposed with its bottom surface against the top surface of the probe card;

means for affixing the front mounting plate to the top surface of the probe card; and

means for urging the space transformer against the top surface of the probe card.

16. Probe Card Assembly, according to claim 15, wherein:

the front mounting plate is made of stainless steel.

17. Probe Card Assembly, according to claim 15, wherein the means for urging the space transformer comprises:

a mounting ring; and

a plurality screws holding the mounting ring to the front mounting plate with the space transformer captured therebetween.

18. Probe Card Assembly, according to claim 17, wherein:

the mounting ring is made of a springy material.

19. Probe Card Assembly, according to claim 17, further comprising:

a spacer ring disposed between the mounting ring and the top surface of the space transformer.

20. Probe Card Assembly, according to claim 15, wherein the means for affixing the front mounting plate comprises:

a rear mounting plate made of a rigid material, having a top surface and a bottom surface, and disposed with its top surface against the bottom surface of the probe card; and

a plurality of screws extending between the front mounting plate and the rear mounting plate, through the probe card.

21. Probe Card Assembly, according to claim 20, wherein:

the rear mounting plate is made of stainless steel.

22. Probe Card Assembly, according to 8, further comprising:

means for adjusting the planarity of the space transformer without changing the orientation of the probe card.

23. Probe Card Assembly, according to claim 22, wherein the means for adjusting the planarity of the space transformer comprises:

a plurality of differential screws, each including an outer differential screw element an inner differential screw element, acting upon the bottom surface of the space transformer.

24. Probe Card Assembly, according to claim 23, further comprising:

a plurality of pivot spheres disposed on ends of the inner differential screw elements.

25. Probe Card Assembly, according to claim 23, further comprising:

an actuator mounting plate disposed beneath the probe card;

wherein;

the differential screws are threaded into the actuator mounting plate.

26. Probe Card Assembly, according to claim 22, wherein the means for adjusting the planarity of the space transformer comprises:

a plurality of actuators, responsive to a computer, acting upon the bottom surface of the space transformer.

27. Probe Card Assembly, according to claim 8, wherein:

the contact pads are disposed at a first pitch on the bottom surface of the space transformer;

the third plurality of resilient contact structures are disposed at a second pitch on the top surface of the space transformer; and

the first pitch is greater than the second pitch.

28. Probe Card Assembly, according to claim 8, wherein:

the first plurality of resilient contact structures are disposed at a first pitch on the bottom surface of the interposer;

the second plurality of resilient contact structures are disposed at a second pitch on the top surface of the interposer; and

the first pitch is the same as the second pitch.

29. Probe Card Assembly, according to claim 8, wherein:

the contact pads are disposed at a first pitch on the bottom surface of the space transformer;

the third plurality of resilient contact structures are disposed at a second pitch on the top surface of the space transformer;

the first plurality of resilient contact structures are disposed at the first pitch on the bottom surface of the interposer;

the second plurality of resilient contact structures are disposed at the first pitch on the top surface of the interposer; and

the first pitch is greater than the second pitch.

30. Probe Card kit, comprising:

a space transformer having a top surface, a bottom surface, a plurality of contact pads disposed on the bottom surface thereof, and a first plurality of resilient contact structures extending from the top surface thereof, said space transformer adapted in use for tips of the first plurality of resilient contact structures making pressure contacts with a plurality of contact areas on a semiconductor wafer; and

an interposer having a top surface, a bottom surface, a second plurality of resilient contact structures extending from the top surface thereof, said interposer adapted in use for tips of the second plurality of resilient contact structures making pressure connections with the plurality of contact pads on the bottom surface of the space transformer, the interposer having a third plurality of contact structures extending from the bottom surface thereof, said interposer adapted in use for tips of the third plurality of resilient contact structures making pressure connections with a plurality of terminals on a probe card.

31. Probe Card Kit, according to claim 30, wherein:

the contact pads are disposed at a first pitch on the bottom surface of the space transformer;

the first plurality of resilient contact structures are disposed at a second pitch on the top surface of the space transformer; and

the first pitch is greater than the second pitch.

32. Probe Card Kit, according to claim 30, wherein:

the third plurality of resilient contact structures are disposed at a first pitch on the bottom surface of the interposer;

the second plurality of resilient contact structures are disposed at a second pitch on the top surface of the interposer; and

the first pitch is the same as the second pitch.

33. Probe Card Assembly, according to claim 30, wherein:

the contact pads are disposed at a first pitch on the bottom surface of the space transformer;

the first plurality of resilient contact structures are disposed at a second pitch on the top surface of the space transformer;

the third plurality of resilient contact structures are disposed at the first pitch on the bottom surface of the interposer;

the second plurality of resilient contact structures are disposed at the first pitch on the top surface of the interposer; and

the first pitch is greater than the second pitch.

36. Resilient contact structure, according to claim 35, wherein:

the resilient contact structure is a probe element mounted to a space transformer.

38. Method, according to claim 37, further comprising:

depositing a joining material on the at least one layer of at least one conductive material previously deposited in the openings.

39. Method, according to claim 38, further comprising:

joining the tip structures to ends of contact structures.

40. Method, according to claim 39, wherein:

the contact structures are resilient contact structures.

41. Method, according to claim 39, wherein:

the contact structures are composite interconnection elements.

42. Method, according to claim 39, wherein:

the contact structures are resilient contact structures disposed atop a space transformer of a probe card assembly.

34. Method of planarizing tips of probes on an interposer assembly, comprising:

providing a support substrate having a top surface, a bottom surface, and a plurality of probe elements extending from the top surface, each probe element having a tip at an end distal from the top surface of the support substrate;

mounting the support substrate on a probe card having a top surface, the bottom surface of the support substrate opposing the top surface of the probe card, said support substrate having an orientation, said probe card having an orientation; and

adjusting the orientation of the support substrate without altering the orientation of the probe card, so as to planarize the tips of the probe elements.

35. Resilient contact structure comprising:

a composite interconnection element having an end; and

a pre-fabricated tip structure joined to the end of the composite interconnection element.

37. Method of fabricating tip structures for ends of contact structures, comprising:

depositing at least one layer of at least one conductive material on a surface of a silicon wafer;

depositing a layer of masking material atop the at least one conductive layer;

patterning openings in the masking material;

depositing at least one layer of at least one conductive material into the openings; and

removing the masking material.