ELECTRO-OPTICAL MATERIAL- BASED DISPLAY DEVICE

• US 20020054266A1
• Filed: 08/23/1999
• Published: 05/09/2002
• Est. Priority Date: 08/23/1999
• Status: Active Grant

• Current Assignee: Wistron Corporation
• Original Assignee: Agilent Technologies, Inc.
• Inventors: NISHIMURA, KEN A.
• Granted Patent: US 6,721,029 B2
• Time in Patent Office: Days
• US Class Current: 349/149
• CPC Class Codes: G02F 1/133351 Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
• CPC Class Codes: G02F 1/1345 Conductors connecting electrodes to cell terminals
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 1/136277 formed on a semiconductor substrate, e.g. of silicon
• CPC Class Codes: G02F 2201/121 common or background
• CPC Class Codes: H01L 27/156 two-dimensional arrays

Abstract

A microdisplay is provided in which a display area, a bonding pad connected to the display area, and a contact pad operatively connected to the bonding pad are all located on a silicon die. An electrically conductive, coated glass is located over the display area and is electrically connected to the contact pad by a flexible conductive material. Under the coated glass is a material which responds to electricity to control the transmission or emission of light.

Claims

1. A display device based on an electro-optical material, comprising:

a semiconductor substrate including an electrical display area, a bonding pad connected to said electrical display area, and a contact pad operatively connected to said bonding pad;

a transparent cover having an electrically conductive coating disposed thereon;

an electrically responsive material disposed between said semiconductor substrate and said transparent cover over said electrical display area; and

a conductive material disposed between said contact pad and said transparent cover in conductive contact with said electrically conductive coating.

2. The display device as claimed in claim 1 including:

an adhesive disposed between said semiconductor substrate and said transparent cover enclosing said electrically responsive material.

3. The display device as claimed in claim 1 wherein:

said conductive material is flexible.

4. The display device as claimed in claim 1 wherein:

said transparent cover has sides and at least one edge flush with the sides and at least one edge of said semiconductor substrate.

5. The display device as claimed in claim 1 including:

circuitry disposed in said operative connection between said contact pad and said bonding pad.

6. The display device as claimed in claim 5 wherein:

said circuitry changes voltage from said bonding pad to said contact pad.

7. The display device as claimed in claim 1 including:

a display-utilizing device; and

conductors connecting said bonding pad to said display-utilizing device.

8. The display device as claimed in claim 1 wherein:

said electrically responsive material is a liquid crystal material.

9. The display device as claimed in claim 1 wherein:

said electrically responsive material includes material for a light emitting diode.

10. A display device based on an electro-optical material, comprising:

a silicon die including an electrical display area, a bonding pad connected to said electrical display area, and a contact pad disposed thereon operatively connected to said bonding pad;

a glass cover having a transparent electrically conductive coating disposed thereon;

an electrical responsive material disposed between said silicon die and said glass cover over said electrical display area; and

a conductive material disposed between said contact pad and said glass cover in conductive contact with said transparent electrically conductive coating.

11. The display device as claimed in claim 10 including:

an adhesive sealant ring disposed between said semiconductor substrate and said transparent cover enclosing said electrically responsive material.

12. The display device as claimed in claim 10 wherein:

said conductive material is a flexible conductive adhesive.

13. The display device as claimed in claim 10 wherein:

said transparent cover has sides and at least one edge flush with the sides and at least one edge of said semiconductor substrate.

14. The display device as claimed in claim 10 including:

circuitry disposed in said operative connection between said contact pad and said bonding pad.

15. The display device as claimed in claim 14 wherein:

said circuitry includes a common electrode bias generator to change voltage from said bonding pad to said contact pad to apply an electrical bias voltage to said transparent electrically conductive coating.

16. The display device as claimed in claim 10 including:

a display-utilizing device; and

bonding wires connecting said bonding pad to said display-utilizing device.

17. The display device as claimed in claim 10 wherein:

said electrically responsive material is a liquid crystal material.

18. The display device as claimed in claim 10 wherein:

said electrically responsive material includes material for a light emitting diode.