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Semiconductor device and method of manufacturing the same

  • US 20020061642A1
  • Filed: 01/11/2002
  • Published: 05/23/2002
  • Est. Priority Date: 09/02/1999
  • Status: Active Grant
First Claim
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1. A method of manufacturing a semiconductor device comprising the steps of;

  • forming a resin layer having a sealing function on a face with electrodes of a semiconductor wafer which has a plurality of semiconductor elements mounted thereon; and

    grinding and thinning a back face of the semiconductor wafer after the resin layer forming process.

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