Probe card and method of fabricating same

• US 20020061668A1
• Filed: 11/16/2001
• Published: 05/23/2002
• Est. Priority Date: 11/17/2000
• Status: Abandoned Application

• Current Assignee: Ando Electric Co., Ltd. (Yokogawa Electric Corporation)
• Original Assignee: Ando Electric Co., Ltd. (Yokogawa Electric Corporation)
• Inventors: Fujimura, Naoyuki
• Application Number:
  US09/991,115
• Publication Number:
  US 20020061668A1
• Time in Patent Office: Days
• US Class Current: 439/83
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: G01R 1/06733 Geometry aspects G01R1/06727 takes precedence
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: H05K 3/3426 characterised by the leads
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

There is provided a probe card for testing a wafer as a whole, wherein parts of probes can be repaired, and adequately secure bonding of the probes with pads is enabled. The probe card for testing a plurality of semiconductor integrated circuits formed on a semiconductor wafer comprises a plurality of the probes for connection with respective testing electrodes of the semiconductor wafer; and wiring board having the pads to be connected with the respective probes. Each of fixed parts where the probes are connected with the respective pads is provided with a hole in order to prevent heat caused by soldering from being conducted to the probes.

Claims

1. A probe card for testing a plurality of semiconductor integrated circuits formed on a semiconductor wafer, said probe card comprising:

a plurality of connection members connected with respective testing electrodes of the semiconductor wafer; and

wiring means electrically connected with the plurality of the connection members, wherein the connection members are bonded by soldering to respective junctions formed on the wiring means, and each of fixed parts where the connection members are connected with the respective junctions by soldering is provided with a wettability reducing part capable of lowering the wettability of solder used in the soldering.

2. A probe card according to claim 1, wherein the connection members are formed by shaping a hard metal into a predetermined shape, and applying a plating treatment thereto.

3. A probe card according to claim 1 or claim 2, wherein the connection members are structured so as to be elastically deformable.

4. A probe card according to claim 3, wherein the connection members are configured into a shape substantially resembling the letter S.

5. A probe card according to claim 1, wherein the wettability reducing part is a hole defined in a side face of the respective fixed parts.

6. A probe card according to claim 1, wherein the wettability reducing part is a partially plated part or a partially coated part, formed on the respective fixed part.

7. A method of fabricating a probe card for testing a plurality of semiconductor integrated circuits formed on a semiconductor wafer, said method comprising the steps of:

forming connection members connected with respective testing electrodes of the semiconductor wafer; and

bonding the connection members as formed with respective junctions formed on wiring means.