Pre-formed fluorescent plate - LED device

• US 20020063520A1
• Filed: 11/29/2000
• Published: 05/30/2002
• Est. Priority Date: 11/29/2000
• Status: Abandoned Application

• Current Assignee: Excellence Optoelectronics Inc.
• Original Assignee: Excellence Optoelectronics Inc.
• Inventors: Chen, Yen-Cheng, Huang, Kuo-Hsin, Huang, Sheng-Bang, Luo, Jyh-Jong, Yu, Huei-Che
• Application Number:
  US09/726,678
• Publication Number:
  US 20020063520A1
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

An LED device has a light emitting chip covered by a pre-formed fluorescent plate for emitting white light. The light emitting chip is located in a chip holder. The pre-formed fluorescent plate is positioned above the light emitting chip and supported by the chip holder. Transparent resin is used to seal the void formed between the chip holder and the pre-formed fluorescent plate. Because the thickness and flatness of the pre-formed fluorescent plate can be easily controlled, white light emitted from the LED device has high quality as well as good uniformity.

Claims

1. A light emitting device comprising;

a chip holder having a cavity;

a light emitting chip located in said cavity;

a pre-formed fluorescent plate positioned above said light-emitting chip and supported by said chip holder;

wherein a void is formed between said pre-formed fluorescent plate and said chip holder, said void being sealed with transparent resin.

2. The light emitting device as claimed in claim 1, said chip holder being formed with a lamp type.

3. The light emitting device as claimed in claim 1, said chip holder being a surface-mount chip holder.

4. The light emitting device as claimed in claim 1, said pre-formed fluorescent plate comprising fluorescent material and transparent resin.

5. The light emitting device as claimed in claim 1, wherein said transparent resin is applied only around the edge of said pre-formed fluorescent plate for bonding said pre-formed fluorescent plate to said chip holder.

6. The light-emitting device as claimed in claim 1, further having a light collecting cup enclosing said pre-formed fluorescent plate.

7. The light emitting device as claimed in claim 1, wherein said pre-formed fluorescent plate has upper and lower surfaces each being formed as a flat, convex or concave surface.

8. The light emitting device as claimed in claim 1, said pre-formed fluorescent layer having an UV protective layer.

9. The light-emitting device as claimed in claim 1, said pre-formed fluorescent layer having a color filter layer.

10. A light emitting device comprising;

a chip holder having a cavity;

a light emitting chip located in said cavity;

a pre-formed fluorescent cap positioned above said light-emitting chip and supported by said chip holder, said pre-formed fluorescent cap being substantially flat with an edge extending down;

wherein a void is formed between said pre-formed fluorescent cap and said chip holder, said void being sealed with transparent resin.

11. The light emitting device as claimed in claim 10, said chip holder being formed with a lamp type.

12. The light emitting device as claimed in claim 10, said chip holder being a surface-mount chip holder.

13. The light emitting device as claimed in claim 10, said pre-formed fluorescent cap comprising fluorescent material and transparent resin.

14. The light emitting device as claimed in claim 10, wherein said transparent resin is applied only around the edge of said pre-formed fluorescent cap for bonding said pre-formed fluorescent cap to said chip holder.

15. The light-emitting device as claimed in claim 10, further having a light collecting cup enclosing said pre-formed fluorescent cap.

16. The light emitting device as claimed in claim 10, wherein said pre-formed fluorescent cap has an upper surface being formed as a flat, convex or concave surface.

17. The light emitting device as claimed in claim 10, further having an UV protective layer disposed over an outer surface of said pre-formed fluorescent cap.

18. The light-emitting device as claimed in claim 10, further having a color filter layer disposed beneath an inner surface of said pre-formed fluorescent cap.