Semiconductor device, and a method of producing semiconductor device

• US 20020064903A1
• Filed: 01/02/2002
• Published: 05/30/2002
• Est. Priority Date: 06/01/1998
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Atsushi Fujishima, Kouji Koizumi, Michiaki Sugiyama, Takatoshi Hagiwara, Yasuyuki Nakajima, Youichi Kawata
• Inventors: Nakajima, Yasuyuki, Sugiyama, Michiaki, Fujishima, Atsushi, Koizumi, Kouji, Kawata, Youichi, Hagiwara, Takatoshi
• Granted Patent: US 6,479,322 B2
• Time in Patent Office: Days
• US Class Current: 438/107
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/06136 Covering only the central area of the surface to be connected, i.e. central arrangements
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4826 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48624 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/85201 Compression bonding
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/85207 Thermosonic bonding
• CPC Class Codes: H01L 2224/92147 the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/4951 Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
• CPC Class Codes: H01L 23/49537 : Plurality of lead frames mounted in one device
• CPC Class Codes: H01L 23/49575 : Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01016 : Sulfur [S]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01083 : Bismuth [Bi]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3511 : Warping

Abstract

A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, comprises a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by soldering outside the resin body after sealing them with resin.

Claims

1. A method of producing a semiconductor device, comprising the steps of:

providing first and second semiconductor chips each having a main surface comprising a semiconductor element and a plurality of external terminals, and a lower surface opposing said main surface, wherein said first and second semiconductor chips are warped,

providing a first lead frame comprising outer portions and inner portions extending from said outer portions, and a second lead frame comprising outer portions and inner portions extending from said outer portions,

fixing the main surface of said first semiconductor chip to the inner portions of said first lead frame, electrically connecting the plurality of external terminals of said first semiconductor chip to the inner portions of said first lead frame, fixing the main surface of said second semiconductor chip to the inner portions of said second lead frame, and electrically connecting the plurality of external terminals of said second semiconductor chip to the inner portions of said second lead frame,

disposing said first and second semiconductor chips, and the inner portions of said first lead frame and said second lead frame, within the interior of a mold cavity such that the lower surfaces of said first and second semiconductor chips are facing each other, and

pressure injecting a resin comprising a mixture of fillers into said mold cavity so as to form a seal, wherein;

a gap between the lower surface of said first semiconductor chip and the lower surface of said second semiconductor chip is maintained wider than a diameter of a largest particle of said fillers, and

after resin injection into the cavity, applying a higher pressure than a pressure applied when pressure injecting the resin.