Inductance element and preparation method thereof

• US 20020067238A1
• Filed: 01/25/2002
• Published: 06/06/2002
• Est. Priority Date: 09/30/1999
• Status: Active Grant

• Current Assignee: Tsung-Fu Leu
• Original Assignee: Tsung-Fu Leu
• Inventors: Leu, Tsung-Fu
• Granted Patent: US 6,633,221 B2
• Time in Patent Office: Days
• US Class Current: 336/221
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 41/04 for manufacturing coils coils for transformer or inductances H01F27/28
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49073 by assembling coil and core

Abstract

The present invention relates to an inductance element and its preparation method. The inductance element comprises a coil structure, an insulation layer, a conductive metal layer and a metal core layer. The preparation method comprises, preparation of a coil structure, applying an insulation material on said coil structure to fix said coil structure, applying a conductive metal layer and plating a magnetic material on said conductive metal layer to form a multiple-layered core structure. In the preparation of the multiple-layered core structure, an intermittent plating approach is adopted, such that the cross-sectional area of the magnetic circuit may be increased. The coil structure applicable to this invention includes one prepared on a printed circuit board or a winded enameled wire coil structure. When a group of two coils is prepared, the inductance element may function as a transformer.

Claims

1. A preparation method for inductance element, comprising the following steps:

prepare a substrate;

prepare at least one coil on said substrate;

said at least one coil having an external side;

prepare a conductive material to connect the external side of said at least on coil to function as an plating electrode; and

form a multileveled multiple-layered magnetic structure on said at least one coil.

wherein material for said multiple-layered magnetic structure comprises a soft magnetic material; and

wherein said multileveled magnetic structure is prepared through intermittent plating.

2. The method according to claim 1 wherein said at least one coil is a winded enameled wire coil, a planar coil or a coil formed on a printed circuit board

3. The method according to claim 1, wherein said conductive material is metalized such that said multiple-layered magnetic structure may be developed on said at least one coil.

4. The method according to claim 1 wherein said soft magnetic material comprises a 21% Permalloy alloy or a super Permalloy.

5. An inductance element prepared according to anyone of claims 1-4.