Universal wafer carrier for wafer level die burn-in
First Claim
1. An testing apparatus for a wafer of semiconductor dice comprising:
- a first rigid support member for receiving a plurality of semiconductor dice in wafer form having a predetermined orientation, the first rigid support member having a plurality of contact members thereon and having a plurality of electrical connectors connected to the contact members for establishing communication with test circuitry;
a second rigid support member for selectively engaging the first rigid support member to retain the plurality of semiconductor dice in wafer form therebetween, one of the first rigid support member and the second rigid support member including a single cavity for retaining said wafer therein during testing; and
a single biasing assembly including a single floating platform of a preselected area substantially sized for said single cavity, the single biasing assembly mounted to one of the first rigid support member and second rigid support member, the single biasing assembly sized for uniformly biasing said wafer form against the contact members.
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Accused Products
Abstract
A reusable bum-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical test equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical test are completed. After bum-in stress and electrical test, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.
27 Citations
8 Claims
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1. An testing apparatus for a wafer of semiconductor dice comprising:
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a first rigid support member for receiving a plurality of semiconductor dice in wafer form having a predetermined orientation, the first rigid support member having a plurality of contact members thereon and having a plurality of electrical connectors connected to the contact members for establishing communication with test circuitry;
a second rigid support member for selectively engaging the first rigid support member to retain the plurality of semiconductor dice in wafer form therebetween, one of the first rigid support member and the second rigid support member including a single cavity for retaining said wafer therein during testing; and
a single biasing assembly including a single floating platform of a preselected area substantially sized for said single cavity, the single biasing assembly mounted to one of the first rigid support member and second rigid support member, the single biasing assembly sized for uniformly biasing said wafer form against the contact members. - View Dependent Claims (2, 3, 4, 5)
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6. A wafer testing apparatus comprising:
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a first rigid support member and a second rigid support member for receiving a wafer therebetween, one of the first rigid support member and second rigid support member including a single cavity for retaining the wafer therein during testing;
a plurality of contact members formed on the first rigid support member for communicating with electrical connectors for connecting to external test circuitry;
a single biasing assembly including a single floating platform having a preselected area substantially sized to correspond with said single cavity and an elastomeric member disposed on the second rigid support member, the single biasing assembly sized for uniformly biasing the wafer towards the contact members, the single floating platform directly supporting the wafer having the elastomeric member sandwiched between the single floating platform and the second rigid support member. - View Dependent Claims (7, 8)
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Specification