Antenna-integrated microwave-millimeter wave module
First Claim
1. An antenna-integrated microwave-millimeter wave module comprising:
- a dielectric substrate;
a first conductor layer provided on said dielectric substrate and having a plurality of first holes formed therein to radiate electromagnetic waves;
a first dielectric layer provided on said first conductor layer;
an antenna feeding line provided on said first dielectric layer;
a second dielectric layer provided on said antenna feeding line;
a second conductor layer provided on said second dielectric layer and having a second hole formed therein;
a third dielectric layer provided on said second conductor layer;
a high-frequency circuit line provided on said third dielectric layer; and
a semiconductor chip connected to said high-frequency circuit line and having a microwave or millimeter wave circuit formed, said first, second and third dielectric layers each having a thickness of at most λ
/4, λ
representing wavelength of electromagnetic waves propagating through the dielectric layers, and said first, second and third dielectric layers having a relative dielectric constant of 10 or less.
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Accused Products
Abstract
A microwave circuit or a millimeter wave circuit is formed on a semiconductor chip. A multilayer substrate is formed of a first dielectric layer, a second dielectric layer and a third dielectric layer. A high-frequency circuit line with the semiconductor chip mounted thereon is formed on the third dielectric layer. A slot hole is formed on one side of the second dielectric layer and an antenna feeding line is formed on the other side. The first dielectric layer has a plurality of slot holes formed therein that radiate electromagnetic waves. An organic substrate is laminated to the multilayer substrate by an adhesion layer.
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Citations
11 Claims
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1. An antenna-integrated microwave-millimeter wave module comprising:
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a dielectric substrate;
a first conductor layer provided on said dielectric substrate and having a plurality of first holes formed therein to radiate electromagnetic waves;
a first dielectric layer provided on said first conductor layer;
an antenna feeding line provided on said first dielectric layer;
a second dielectric layer provided on said antenna feeding line;
a second conductor layer provided on said second dielectric layer and having a second hole formed therein;
a third dielectric layer provided on said second conductor layer;
a high-frequency circuit line provided on said third dielectric layer; and
a semiconductor chip connected to said high-frequency circuit line and having a microwave or millimeter wave circuit formed, said first, second and third dielectric layers each having a thickness of at most λ
/4, λ
representing wavelength of electromagnetic waves propagating through the dielectric layers, andsaid first, second and third dielectric layers having a relative dielectric constant of 10 or less. - View Dependent Claims (2, 3, 4)
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5. An antenna-integrated microwave-millimeter wave module comprising:
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a first conductor layer having a plurality of first holes formed therein to radiate electromagnetic waves;
a first dielectric layer provided on said first conductor layer;
an antenna feeding line provided on said first dielectric layer;
a second dielectric layer provided on said antenna feeding line;
a second conductor layer provided on said second dielectric layer and having a second hole formed therein;
a third dielectric layer provided on said second conductor layer;
a high-frequency circuit line provided on said third dielectric layer and electromagnetically coupled with said antenna feeding line via said second hole; and
a semiconductor chip connected to said high-frequency circuit line and having a microwave or millimeter wave circuit formed, said first holes including a feed slot hole fed by said antenna feeding line and a non-feed slot hole not fed by said antenna feeding line, and distance d between said feed slot hole and said non-feed slot hole being approximately (0.5+n) λ
, λ
representing wavelength of electromagnetic waves propagating through the dielectric layers and n being an integer of at least 1. - View Dependent Claims (6, 7, 8, 9, 10, 11)
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Specification