Packaging systems and methods for thin film solid state batteries
First Claim
1. A thin film battery having a protective coating that is heat-resistant and hermetically seals the thin film battery, comprising:
- a. a substrate having a thin film deposited thereon including a cathode current collector, a cathode, an electrolyte, an anode and an anode current collector;
b. a first thin film layer of dielectric material selected from the group consisting of;
i. aluminum oxide;
ii. silicon dioxide;
iii. silicon nitride;
iv. silicon carbide;
v. tantalum oxide;
vi. diamond; and
vii. diamond-like-carbon;
c. a second thin film layer of dielectric material selected from the group consisting of i. aluminum oxide;
ii. silicon dioxide;
iii. silicon nitride;
iv. silicon carbide;
v. tantalum oxide;
vi. diamond; and
vii. diamond-like-carbon; and
d. a sealing layer positioned over the second thin film layer and covering the entire thin film battery.
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Accused Products
Abstract
A thin film battery having a protective package that provides a heat-resistant, hermetic seal for the thin film battery. A thin film battery includes thin film layers of components such as a cathode current collector, a cathode, an electrolyte, an anode, and an anode current collector built up on a substrate. Layers of dielectric material are positioned over the thin film battery. Suitable dielectric materials include aluminum oxide, silicon dioxide, silicon nitride, silicon carbide, tantalum oxide, diamond, and diamond-like-carbon. The dielectric materials are annealed. A layer of epoxy is positioned completely over all layers of the thin film battery and cured under ultraviolet light. Finally, the epoxy is annealed. The resultant thin film battery has a package that provides protection from the atmosphere, high temperatures, undesirable gases and can withstand processes utilized in the semiconductor and other industries to produce printed circuit boards with surface mounted thin film batteries.
142 Citations
20 Claims
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1. A thin film battery having a protective coating that is heat-resistant and hermetically seals the thin film battery, comprising:
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a. a substrate having a thin film deposited thereon including a cathode current collector, a cathode, an electrolyte, an anode and an anode current collector;
b. a first thin film layer of dielectric material selected from the group consisting of;
i. aluminum oxide;
ii. silicon dioxide;
iii. silicon nitride;
iv. silicon carbide;
v. tantalum oxide;
vi. diamond; and
vii. diamond-like-carbon;
c. a second thin film layer of dielectric material selected from the group consisting of i. aluminum oxide;
ii. silicon dioxide;
iii. silicon nitride;
iv. silicon carbide;
v. tantalum oxide;
vi. diamond; and
vii. diamond-like-carbon; and
d. a sealing layer positioned over the second thin film layer and covering the entire thin film battery. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of providing a protective coating for a thin film battery cell, comprising the steps of:
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a. positioning a layer of aluminum oxide upon the thin film battery cell;
b. positioning a layer of silicon dioxide upon the layer of aluminum oxide; and
c. positioning a layer of epoxy upon the layer of silicon dioxide such that the layer of epoxy covers the entire thin film battery cell. - View Dependent Claims (9, 10, 11, 12, 14, 15, 16, 17, 18, 19)
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13. A method of providing a protective coating for a thin film battery cell, comprising the steps of:
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a. positioning layers of a protective coating material upon the thin film battery cell, and b. sealing the protective coating such that the resulting thin film battery cell having a protective coating is impervious to heat, moisture and atmospheric elements.
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20. A method of producing a thin film battery having a protective coating that is heat-resistant and hermetically sealed, comprising:
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a. depositing at least one thin film layer of a dielectric material upon the thin film battery;
b. annealing the at least one thin film layer of dielectric material at about 260°
C.;
c. covering the at least one thin film layer of dielectric material with an epoxy;
d. curing the epoxy using an ultraviolet light;
e. annealing the epoxy at about 260°
C. for about six minutes.
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Specification