Seed layer recovery
First Claim
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1. A method of removing oxidized metal from a metal seed layer comprising the steps of:
- a) contacting a metal seed layer containing oxidized metal disposed on a substrate with an aqueous solution having a pH maintained in the range of about 6.5 to about 13;
b) subjecting the solution to a voltage of from about 0.1 to 5 volts to reduce the oxidized metal; and
c) monitoring the reduction of the oxidized metal to provide a seed layer substantially free of all oxidized metal species.
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Abstract
Disclosed is a method for repairing of seed layers by removal of oxidized metal from the seed layers prior to subsequent metallization. Also disclosed is a method for monitoring such repair to provide substantially metal oxide free seed layers.
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Citations
24 Claims
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1. A method of removing oxidized metal from a metal seed layer comprising the steps of:
- a) contacting a metal seed layer containing oxidized metal disposed on a substrate with an aqueous solution having a pH maintained in the range of about 6.5 to about 13;
b) subjecting the solution to a voltage of from about 0.1 to 5 volts to reduce the oxidized metal; and
c) monitoring the reduction of the oxidized metal to provide a seed layer substantially free of all oxidized metal species. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
- a) contacting a metal seed layer containing oxidized metal disposed on a substrate with an aqueous solution having a pH maintained in the range of about 6.5 to about 13;
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11. A method for manufacturing an electronic device comprising the steps of:
- a) contacting a metal seed layer containing oxidized metal disposed on a substrate with an aqueous solution having a pH maintained in the range of about 6.5 to about 13;
b) subjecting the solution to a voltage of from about 0.1 to 5 volts to reduce the oxidized metal;
c) monitoring the reduction of the oxidized metal to provide a substantially metal oxide free seed layer; and
d) contacting the substantially metal oxide free seed layer with an electroplating bath. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
- a) contacting a metal seed layer containing oxidized metal disposed on a substrate with an aqueous solution having a pH maintained in the range of about 6.5 to about 13;
- 21. A method for manufacturing an electronic device comprising the step of monitoring the oxidation state of metal in a seed layer deposited on a substrate.
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22. The method of claim 22 wherein a potentiostat is used to monitor the oxidation state of the metal.
Specification