Wiring substrate, wiring board, and wiring substrate mounting structure

• US 20020074654A1
• Filed: 11/27/2001
• Published: 06/20/2002
• Est. Priority Date: 11/28/2000
• Status: Abandoned Application

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Koriyama, Shinichi
• Application Number:
  US09/996,349
• Publication Number:
  US 20020074654A1
• Time in Patent Office: Days
• US Class Current: 257/728
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/1903 : including wave guides
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H05K 1/0243 : Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/0272 : Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 2201/09854 : Hole or via having special cross-section, e.g. elliptical
• CPC Class Codes: H05K 2201/10545 : Related components mounted on both sides of the PCB
• CPC Class Codes: H05K 2201/10727 : Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 3/429 : Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

In a wiring substrate, a high-frequency component is carried on a dielectric board having a transmission line formed on its surface, a reverse surface of the dielectric board is formed with an opening in a predetermined cross-sectional shape, and a high-frequency connecting pad is formed around the opening. In the wiring board, a dielectric board penetrates a waveguide structure and has its inner wall coated with a conductor, and a high-frequency connecting pad is formed on a surface of the dielectric board. The wiring substrate is placed on the wiring board, and the respective high-frequency connecting pads are electrically connected to each other, to fabricate a module. Even when a low-cost material having a large dielectric loss tangent is used for the wiring board, a high-frequency signal can be prevented from being attenuated.

Claims

1. A wiring substrate having a dielectric substrate having a high-frequency component and a transmission line formed on its surface,

said dielectric substrate being formed with an opening in a predetermined cross-sectional shape,

a high-frequency connecting pad coated with a conductor layer around said opening being formed on a reverse surface of said dielectric substrate,

a power pad being formed on the reverse surface of the dielectric substrate to be connected with the power line formed on the surface of the dielectric substrate,

a matching section for high-frequency coupling said transmission line and a waveguide structure connected to said high-frequency connecting pad to each other being formed in said opening.

2. The wiring substrate according to claim 1, wherein

said high-frequency connecting pad is connected to the waveguide structure by a brazing material.

3. The wiring substrate according to claim 1, wherein

a cover for hermetically sealing said high-frequency component is attached to the surface of said dielectric substrate.

4. The wiring substrate according to claim 1, wherein

the conductor layer in said high-frequency connecting pad is hollowed inward from the reverse surface of the dielectric substrate.

5. The wiring substrate according to claim 1, wherein

two or more high-frequency connecting pads are formed on the reverse surface of said dielectric substrate.

6. The wiring substrate according to claim 1, wherein

said transmission line is a microstrip line, and

said matching section comprises a microstrip line having an opened terminal end, a slot hole formed in a ground layer for the microstrip line, and a dielectric provided below the slot hole.

7. The wiring substrate according to claim 6, wherein

said slot hole is formed at the center of the opening of said high-frequency connecting pad,

a vertical conductor for connecting said ground layer and said high-frequency connecting pad is formed along said opening, and

said matching section is formed in a region enclosed by the vertical conductor.

8. The wiring substrate according to claim 1, wherein

said dielectric substrate is composed of ceramics.

9. The wiring substrate according to claim 1, wherein

said wiring substrate being mounted on a predetermined wiring board by connecting said high-frequency and power pads to the wiring board by a brazing material.

10. A wiring board comprising:

a dielectric board;

a waveguide structure penetrating the dielectric board from its surface to its reverse surface, having a predetermined cross-sectional opening shape, and having its inner wall coated with a conductor; and

a high-frequency connecting pad provided around said waveguide structure on the surface of said dielectric board.

11. A wiring substrate mounting structure in which a wiring substrate is placed on a surface of a wiring board, wherein

said wiring board comprises a waveguide structure penetrating a dielectric board from its surface to its reverse surface, having a predetermined cross-sectional opening shape, and having its inner wall coated with a conductor, and a high-frequency connecting pad provided around said waveguide structure on the surface of said dielectric board,

said wiring substrate has a dielectric substrate having a high-frequency component and a transmission line formed on its surface, said dielectric substrate being formed with an opening in a predetermined cross-sectional shape, a high-frequency connecting pad being formed around said opening on a reverse surface of said dielectric substrate, and a matching section for high-frequency coupling said transmission line and the waveguide structure to each other being formed in said opening, and

the high-frequency connecting pad in said wiring substrate and the high-frequency connecting pad in said wiring board are connected to each other.

12. The wiring substrate mounting structure according to claim 11, wherein

the dielectric substrate in said wiring substrate is composed of a ceramics insulating material, and

the dielectric board in said wiring board is composed of an insulating material containing organic resin.

13. The wiring substrate mounting structure according to claim 11, wherein

a high-frequency component is carried on said wiring substrate, and

a low-frequency component is carried on said wiring board.

14. The wiring substrate mounting structure according to claim 11, wherein

a conductor layer having the same opening shape as the opening shape of a waveguide is formed on a reverse surface of said wiring board.

15. The wiring substrate mounting structure according to claim 11, wherein

the dielectric board in said wiring board is formed with a screw hole for screwing an external circuit.

16. The wiring substrate mounting structure according to claim 11, wherein

the difference in coefficients of thermal expansion at room temperature to a temperature of 300°

C. between the dielectric substrate in said wiring substrate and the dielectric board in the wiring board is not more than 10×

10<sup>−

6</sup>/K.

17. The wiring substrate mounting structure according to claim 11, wherein

a high frequency signal is transmitted to an external circuit having a waveguide port via the waveguide structure in said wiring board.

18. The wiring substrate mounting structure according to claim 11, wherein

another wiring substrate is mounted on the reverse surface of said wiring board.

19. A wiring substrate mounting structure, wherein

a plurality of wiring substrates having high-frequency components respectively carried thereon are mounted on a surface of a wiring board, and another wiring substrate is mounted on a reverse surface of said wiring board,

said wiring board comprises at least two waveguide structures each penetrating a dielectric board from its surface to its reverse surface, having a predetermined cross-sectional opening shape, and having its inner wall coated with a conductor, and high-frequency connecting pads respectively provided around said waveguide structures on the surface and the reverse surface of said dielectric board,

each of said wiring substrates mounted on the surface of said wiring board has a dielectric substrate having a high-frequency component and a transmission line formed on its surface, said dielectric substrate being formed with an opening in a predetermined cross-sectional shape, a high-frequency connecting pad coated with a conductor layer around said opening being formed on a reverse surface of said dielectric substrate, and a matching section for high-frequency coupling said transmission line and the waveguide structure to each other being formed in said opening, and

said wiring substrate mounted on the reverse surface of said wiring board has a dielectric substrate having a transmission line formed therein, said dielectric substrate being formed with two openings in a predetermined cross-sectional shape, a high-frequency connecting pad coated with a conductor layer around each of said openings being formed on the surface of said dielectric substrate, and a matching section for high-frequency coupling said transmission line and the waveguide structure to each other being formed in each of said openings, and

the openings of the wiring substrates mounted on the surface of the wiring board are respectively coupled to said two waveguide structures on the surface of said wiring board, and the opening of the wiring board mounted on the reverse surface of said wiring board is coupled to said two waveguide structures on the reverse surface of the wiring board.