Enclosure for MEMS apparatus and method of using the same

• US 20020075551A1
• Filed: 11/20/2001
• Published: 06/20/2002
• Est. Priority Date: 11/29/2000
• Status: Abandoned Application

• Current Assignee: Analog Devices, Inc.
• Original Assignee: ONIX Microsystems Incorporated
• Inventors: Wall, Franklin, Behin, Behrang, Daneman, Michael J.
• Application Number:
  US09/989,905
• Publication Number:
  US 20020075551A1
• Time in Patent Office: Days
• US Class Current: 359/254
• CPC Class Codes: B81B 7/0067 for controlling the passage of optical signals through the package
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: G02B 26/085 the reflecting means being moved or deformed by electromagnetic means

Abstract

An enclosure for sealing a MEMS optical device, a MEMS apparatus, a MEMS module, and a method for switching optical signals are disclosed. The enclosure includes one or more sidewalls and an optical element hermetically sealed to at least one of the sidewalls. Suitable optical elements include windows, lenses and lens arrays. The enclosure may be evacuated to improve the performance of the MEMS device enclosed within it. The MEMS apparatus includes a MEMS device enclosed by an enclosure of the type described above. The MEMS device may include a substrate and the enclosure may be bonded to the substrate. Alternatively, the MEMS device may include a substrate attached to a mount and the enclosure may be bonded to the mount. The MEMS module includes a mount and a MEMS device attached to the mount. One or more optical fibers are attached to the mount proximate the MEMS device. An enclosure, attached to the mount encloses the MEMS device. The fibers are located outside the enclosure. Optical signals may be coupled between the fibers and the MEMS device within the enclosure through an optical elements in the sidewall. The optical switching method proceeds by reducing a pressure of an atmosphere proximate the MEMS optical device and moving at least one of the optical elements from a first position to a second position. The optical element deflects an optical signal when it is in the second position.

Claims

1. An enclosure for sealing a MEMS device, comprising

one or more sidewalls,

an optical element coupled to at least one of the sidewalls,

wherein at least one of the one or more sidewalls or the optical element includes a surface that is angled with respect to an optical plane,

wherein the dimensions of the enclosure are such that the enclosure completely encloses the MEMS device.

2. The enclosure of claim 1, wherein the optical element is chosen from the group consisting of simple refractive surfaces, partially reflective surfaces, curved refracting or partially reflecting, surfaces, prisms, lenses, diffractive elements, fresnel lenses, anti-reflective coated surfaces, and dichroic coated surfaces.

3. The enclosure of claim 1, and the optical element is a window.

4. The enclosure of claim 1 further comprising an optically transparent window disposed on top of the enclosure.

5. The enclosure of claim 1, wherein the optical element is a wedge-shaped window.

6. The enclosure of claim 1, wherein the enclosure is evacuated.

7. The enclosure of claim 1, wherein the enclosure is filled with a gas.

8. The enclosure of claim 7, wherein the gas provides moisture-free environment for the MEMS device to operate in.

9. The enclosure of claim 7, wherein the gas is selected from the group consisting of thermal conductor, thermal insulator, electrical conductor and electrical insulator.

10. The enclosure of claim 7 where in the gas prevents squeeze film or viscous damping of the MEMS device.

11. A MEMS apparatus comprising:

a MEMS device;

an enclosure that encloses the MEMS device;

an enclosure having one or more vertical sidewalls,

an optical element located an opening in at least one of the sidewalls,

wherein at least one of the one or more sidewalls or the optical element includes a surface that is angled with respect to an optical plane.

12. The apparatus of claim 11, wherein the optical element is a window and at least one of the one or more sidewalls includes a surface that is angled with respect to an optical plane,

wherein the window is attached to the surface.

13. The MEMS apparatus of claim 11, wherein the MEMS device includes a substrate and the enclosure is bonded to the substrate.

14. The MEMS device of claim 13, further comprising a device controller chip attached to a back side of the substrate.

15. The MEMS apparatus of claim 11, wherein the MEMS device includes a substrate attached to a mount and the enclosure is bonded to the mount.

16. The MEMS apparatus of claim 11, wherein the enclosure is evacuated.

18. The MEMS module of claim 17 wherein said optical element is a window and optical signals may be coupled between the MEMS device and the optical fibers through the one or more optical elements.

19. The MEMS module of claim 17 further comprising a control electronics unit coupled to the MEMS device.

20. The MEMS module of claim 19, wherein the control electronics unit is a device controller chip attached to a back side of a substrate of the MEMS device.

21. The MEMS module of claim 20, wherein the enclosure is evacuated.

22. The MEMS module of claim 20, wherein the enclosure is filled with a gas.

24. The method of claim 23 further comprising:

returning the MEMS optical element to the first position.

17. A MEMS module, comprising

a mount;

a MEMS device attached to the mount;

one or more optical fibers attached to the mount proximate the MEMS device; and

an enclosure attached to the mount and enclosing the MEMS device,

wherein the enclosure has one or more vertical sidewalls,

wherein at least one sidewall includes one or more optical elements sealed to an opening in the sidewall,

wherein the fibers are optically coupled to the device via the one or more optical elements,

wherein at least one of the one or more sidewalls or the optical element includes a surface that is angled with respect to an optical plane, and

wherein the fibers are located outside the enclosure.

23. A method for switching optical signals with a microelectromechanical system (MEMS) optical device having one or more moveable MEMS optical elements, the steps comprising:

In a reduced pressure atmosphere proximate the MEMS optical device, moving at least one of the optical elements from a first position to a second position; and

deflecting an optical signal with the at least one optical element when it is in the second position.