Method and device for protecting micro electromechanical systems structures during dicing of a wafer
First Claim
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1. A method for protecting a MEMS structure during a dicing of a MEMS wafer to produce individual MEMS dies, comprising the steps of:
- (a) preparing a MEMS wafer having a plurality of MEMS structure sites on a first side and a plurality of through holes on a second side;
(b) mounting, upon the first side of the MEMS wafer, a wafer cap to produce a laminated MEMS wafer, the wafer cap being recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer;
(c) mounting, upon the second side of the MEMS wafer, a layer of dicing tape;
(d) dicing the laminated MEMS wafer into a plurality of MEMS dies; and
(e) mounting, upon the layer of dicing tape, a layer of transfer tape
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Accused Products
Abstract
A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
187 Citations
60 Claims
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1. A method for protecting a MEMS structure during a dicing of a MEMS wafer to produce individual MEMS dies, comprising the steps of:
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(a) preparing a MEMS wafer having a plurality of MEMS structure sites on a first side and a plurality of through holes on a second side;
(b) mounting, upon the first side of the MEMS wafer, a wafer cap to produce a laminated MEMS wafer, the wafer cap being recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer;
(c) mounting, upon the second side of the MEMS wafer, a layer of dicing tape;
(d) dicing the laminated MEMS wafer into a plurality of MEMS dies; and
(e) mounting, upon the layer of dicing tape, a layer of transfer tape - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 24, 25, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 45)
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9. The method as claimed in 5, wherein a height of the spacer layer prevents the wafer cover from deflecting in such a manner to come in contact with the MEMS structures.
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10. The method as claimed in 5, wherein a height of the spacer layer prevents electrostatically induced damage to the MEMS wafer.
- 11. The method as claimed in 5, wherein a height of the spacer layer prevents electrostatically induced damage to the MEMS wafer and prevents the wafer cover from deflecting in such a manner to come in contact with the MEMS structures.
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12. A laminated MEMS wafer, comprising:
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a MEMS wafer having a plurality of MEMS structure sites located on a first side and a plurality of through holes located on a second side;
a removable wafer cap;
a layer of dicing tape mounted upon the second side of the MEMS wafer; and
a layer of transfer tape mounted upon said layer of dicing tape;
said removable wafer cap being bonded to the first side of the MEMS wafer to produce a laminated MEMS wafer, the wafer cap being recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer.
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- 22. The laminated MEMS wafer as claimed in 16, wherein a height of said spacer layer prevents said wafer cover from deflecting in such a manner to come in contact with the MEMS structures.
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23. The laminated MEMS wafer as claimed in 16, wherein a height of said spacer layer prevents electrostatically induced damage to said MEMS wafer.
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26. A method for protecting a wafer during a dicing, comprising the steps of:
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(a) mounting, upon a backside of a wafer, a layer of dicing tape, the wafer having a front patterned side and a plurality of etched ports on a backside, the etched ports providing a possible leak path from a backside of the wafer to the front patterned side of the wafer;
(b) dicing the wafer into a plurality of dies; and
(c) mounting, upon the diced layer of dicing tape, a layer of transfer tape.
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30. A wafer, comprising:
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a wafer having a front patterned side and a plurality of etched ports on a backside, the etched ports providing a possible leak path from a backside of the wafer to the front patterned side of the wafer;
a layer of dicing tape mounted upon the backside of said wafer; and
a layer of transfer tape mounted upon said layer of dicing tape. - View Dependent Claims (31)
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- 44. The method as claimed in 32, wherein a height of the perforated tape prevents electrostatically induced damage.
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59. The laminated MEMS wafer as claimed in 46, wherein a height of said perforated tape prevents electrostatically induced damage.
Specification