I-channel surface-mount connector

• US 20020076951A1
• Filed: 12/15/2000
• Published: 06/20/2002
• Est. Priority Date: 12/15/2000
• Status: Active Grant

• Current Assignee: Bel Power Solutions Inc.
• Original Assignee: DI/DT, Inc. (ABB Limited)
• Inventors: Roy, Apurba
• Granted Patent: US 6,750,396 B2
• Time in Patent Office: Days
• US Class Current: 439/65
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01R 12/52 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H05K 2201/1031 Surface mounted metallic connector elements
• CPC Class Codes: H05K 2201/10666 Plated through-hole for surface mounting on PCB
• CPC Class Codes: H05K 2201/10856 Divided leads, e.g. by slot in length direction of lead, or by branching of the lead
• CPC Class Codes: H05K 3/3426 characterised by the leads
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49211 of fused material

Abstract

In accordance with the invention, a low impedance surface-mount connector comprises a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of low resistance, low inductance, mechanical compliance and ease of manufacture. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.

Claims

1. A surface mount connector for electrically connecting two circuit devices comprising:

a cylindrical metallic body of I-shaped cross section, the body comprising a longitudinally extending central beam section having as each longitudinally extending edge a laterally extending base section, the beam section comprising a pair of major surfaces, and each base section having a mounting surface perpendicular to the central beam section for bonding to a circuit device.

2. The surface mount connector of claim 1 wherein the body further comprises one or more slots extending transversely through the central beam section.

3. The surface mount connector of claim 1 wherein the one or more slots divide the major surfaces of the beam sections into a plurality of regions, each region having a height greater than its length.

4. The surface mount connector of claim 1 wherein the body further comprises one or more slots extending transversely through one of the base sections.

5. The surface mount connector of claim 1 wherein the height of the body measured between the mounting surfaces exceeds the length of the body.

6. The surface mount connector of claim 1 wherein the height of the body measured between the mounting surfaces exceeds the width of the base section.

7. The surface mount connector of claim 1 wherein the body is copper or silver and is plated for solderability.

8. The surface mount connector of claim 2 wherein one or more of the slots has dimensions geometrically similar to the central beam section.

9. The surface mount connector of claim 1 wherein the body comprises a solid body of extruded copper or silver.

10. The surface mount connector of claim 1 wherein the body comprises a hollow cylinder of bent copper alloy sheet material.

11. The surface mount connector of claim 1 wherein the base sections have laterally extending ends with rounded edges to facilitate secure solder bonding.

12. The surface mount connector of claim 1 wherein the central beam section includes recessed end regions.

13. An interconnected device comprising two circuit devices interconnected by the connector of claim 1.

14. An interconnected device comprising two circuit devices interconnected by the connector of claim 2.

15. An interconnected device comprising two circuit devices interconnected by the connector of claim 3.

16. A method for interconnecting a first circuit device to a second circuit device comprising the steps of:

providing said first circuit device with one or more mounting pads;

placing on said mounting pads one or more surface-mount connectors of claim 1;

soldering said one or more connectors to said first circuit device;

providing a second circuit device with one or more mounting pads for receiving said connectors on said first circuit device;

placing said first circuit device on said second circuit device with said connectors on said mounting pads of said second circuit device; and

soldering said connectors to said mounting pads on said second surface device.

17. A method for interconnecting a first circuit device to a second circuit device comprising the steps of:

providing said first circuit device with one or more mounting pads;

placing on said mounting pads one or more surface-mount connectors of claim 2;

soldering said one or more connectors to said first circuit device;

providing a second circuit device with one or more mounting pads for receiving said connectors on said first circuit device;

placing said first circuit device on said second circuit device with said connectors on said mounting pads of said second circuit device; and

soldering said connectors to said mounting pads on said second circuit device.

18. The method of claim 16 or claim 17 wherein said at least one surface mount connector is soldered to said first circuit device by solder reflow.

19. The method of claim 16 or claim 17 wherein the surface mount connectors on said first circuit device are soldered to said second circuit device by solder reflow.