DIRECT BGA SOCKET FOR HIGH SPEED USE
First Claim
1. A socket for an integrated circuit package having spherical contacts on its bottom surface, the socket comprising:
- a nonconductive substrate;
a plurality of conductive circuit paths on the substrate;
an array of resilient electrically conductive pads on the substrate having substantially the same configuration and pitch as the spherical contacts on the package;
the array of electrically conductive pads being selectively electrically connected to the conductive circuit paths;
a means of aligning the spherical contacts with the conductive pads; and
a means for bringing the spherical contacts into electrical contact with the electrically conductive pads;
wherein when the electrically conductive pads electrically contact the spherical contacts, and the resilience of the electrically conductive pads compensates for any lack of planarity in the spherical contacts.
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Accused Products
Abstract
The present invention relates to a socket for testing ICs and, in particular, high speed ICs in BGA packages. The socket uses resilient conductive test pads positioned on a substrate in an array to match an array of spherical contacts of the bottom of a BGA package. The BGA package is aligned with the test pads by the use of holes centered on the test pads into which the spherical contacts are seated. The holes may also be used to interconnect conductive signal paths on layers of the substrate.
The present invention is also directed to a means of holding an IC package in position in the test socket. In particular, the test socket is provided with two flexible seals on the top of a support, which encircle the test pads. The flexible seals, together with a top surface of a support and a socket lid define an enclosed cavity. A vacuum is applied to the enclosed cavity, which compresses the flexible seals and pulls the socket lid towards the test pads. The bottom surface of the socket lid is adapted to apply downward force to the IC package to force the IC package leads into contact with the test pads when the socket lid is moved towards the test pads.
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Citations
25 Claims
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1. A socket for an integrated circuit package having spherical contacts on its bottom surface, the socket comprising:
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a nonconductive substrate;
a plurality of conductive circuit paths on the substrate;
an array of resilient electrically conductive pads on the substrate having substantially the same configuration and pitch as the spherical contacts on the package;
the array of electrically conductive pads being selectively electrically connected to the conductive circuit paths;
a means of aligning the spherical contacts with the conductive pads; and
a means for bringing the spherical contacts into electrical contact with the electrically conductive pads;
wherein when the electrically conductive pads electrically contact the spherical contacts, and the resilience of the electrically conductive pads compensates for any lack of planarity in the spherical contacts. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 21, 23, 24)
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19. An apparatus for retaining a plurality of contacts of an integrated circuit package in contact with a plurality of pads of a socket comprising:
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a support surrounding the pads and defining a socket opening for the integrated circuit package;
a removable lid having a substantially flat bottom surface and a spring means attached to the bottom surface;
a first flexible seal on a top surface of the support surrounding the opening;
a second flexible seal outside the first flexible seal on the top surface of the support surrounding the opening;
the top surface of the support, the bottom surface of the lid, the first flexible seal and the second flexible seal defining a cavity;
a means of applying a vacuum to the cavity;
wherein the vacuum compresses the first flexible seal and the second flexible seal thereby forcing the spring means on the lid to apply a downward force to the package to bring the spherical contacts into electrical contact with the pads.
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22. A socket for an integrated circuit package having spherical contacts on its bottom surface, the socket comprising:
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a nonconductive substrate;
a plurality of conductive circuit paths on the substrate;
a means of selectively electrically connecting the conductive circuit paths to the spherical contacts; and
an array of holes on the substrate having substantially the same configuration and pitch as the spherical contacts on the package, each of the holes in the array of holes having a diameter which is at least ⅓
but no more than ½
of a diameter of the spherical contacts;
wherein the holes are adapted to seat the spherical contacts. - View Dependent Claims (25)
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Specification