Plasma enhanced chemical processing reactor and method

• US 20020078893A1
• Filed: 11/16/2001
• Published: 06/27/2002
• Est. Priority Date: 05/18/2000
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Os, Ron van, Fenske, Dennis C., Durbin, William J., Ross, Eric D., Matthiesen, Richard H.
• Application Number:
  US09/994,008
• Publication Number:
  US 20020078893A1
• Time in Patent Office: Days
• US Class Current: 118/723I
• CPC Class Codes: C23C 16/4558 Perforated rings
• CPC Class Codes: C23C 16/463 Cooling of the substrate
• CPC Class Codes: C23C 16/507 using external electrodes, e.g. in tunnel type reactors
• CPC Class Codes: H01J 37/321 the radio frequency energy being inductively coupled to the plasma
• CPC Class Codes: H01J 37/3244 Gas supply means

Abstract

A plasma enhanced chemical processing reactor and method. The reactor includes a plasma chamber including a first gas injection manifold and a source of electromagnetic energy. The plasma chamber is in communication with a process chamber which includes a wafer support and a second gas manifold. The plasma generated in the plasma chamber extends into the process chamber and interacts with the reactive gases to deposit a layer of material on the wafer. The reactor also includes a vacuum system for exhausting the reactor. The method includes the steps of generating a plasma within the plasma chamber, introducing at least one gaseous chemical into the process chamber proximate to the wafer support and applying r.f. gradient to induce diffusion of the plasma to the area proximate the wafer support.

Claims

1. A plasma enhanced chemical processing reactor, comprising:

a plasma chamber;

a first gas injection manifold communicating with said plasma chamber for receiving at least one first gas;

a source of electromagnetic energy for exciting said at least one first gas to form a plasma;

a process chamber communicating with the plasma chamber whereby the plasma extends into said process chamber;

a wafer support for supporting a wafer, said wafer support disposed in said process chamber;

a second gas manifold, disposed in said process chamber and encircling said wafer support, for directing reactive gases towards said wafer support whereby the reactive gases interact with the plasma to process the surface of a wafer supported on said wafer support; and

a vacuum system for removing gases from the bottom of said process chamber.

2. The reactor of claim 1 wherein said source of electromagnetic energy is an inductively coupled plasma source.

3. The reactor of claim 1 wherein said source of electromagnetic energy comprises a helical resonator and a capacitive shield disposed within said helical resonator.

4. The reactor of claim 1 wherein said wafer support is attached to at least one surface of said process chamber, such that said wafer support is suspended within said process chamber.

5. The reactor of claim 1 wherein said vacuum system comprises a turbo pump.

6. The reactor of claim 5 wherein said vacuum system further comprises a vacuum isolation valve disposed between said process chamber and said pump for isolating said process chamber from said pump.

8. The reactor of claim 1 wherein said wafer support comprises a support body having a support surface for retaining said wafer;

a voltage source coupled to said support body for electrostatically coupling said wafer to said support surface;

a cooling system having a plurality of gas distribution grooves formed in said support surface and configured for uniformly distributing a gaseous substance between said wafer and said support surface;

at least one member having two ends, one of said ends attached to said support body and the other said end attached to a surface of said process chamber.

9. The reactor of claim 8 wherein said at least one member is attached to a vertical surface of said process chamber such that said support body is suspended within said process chamber.

10. The reactor of claim 8 wherein said at least one member is hollow and contains therein at least one conduit for passing cooling medium to said support body, and at least one conduit for coupling dc energy to said wafer support.

11. The reactor of claim 10 wherein said at least one member further comprises at least one conduit for coupling r.f. energy to said wafer support.

12. The reactor of claim 1 wherein said wafer support is attached to a carriage assembly, and said carriage assembly is attached to said process chamber, such that said wafer support may be removed from said process chamber.

13. The reactor of claim 1 wherein said first gas manifold comprises at least one plenum formed therein for receiving at least one gaseous chemical;

and

a plurality of holes communicating with each of said at least one plenum and said holes disposed along said plenum, for distributing said at least one gaseous chemical to said plasma chamber.

16. The reactor of claim 15 wherein the interaction with said plasma deposits a layer of material on the surface of the wafer.

17. The reactor of claim 15 wherein the interaction with said plasma etches the surface of the wafer.

19. The reactor of claim 18 wherein said wafer support is attached to at least one surface of said process chamber, such that said wafer support is suspended within said process chamber.

20. The reactor of claim 18 wherein said first gas manifold comprises a plurality of charmels formed therein for discretely receiving at least one gaseous chemical;

and a plurality of holes communicating with each of said channels, for discretely distributing said at least one gaseous chemical to said plasma chamber.

21. The reactor of claim 18 wherein said vacuum system comprises a turbo pump.

22. The reactor of claim 21 wherein said vacuum system further comprises a vacuum isolation valve disposed between said process chamber and said pump for isolating said process chamber from said pump.

23. The reactor of claim 18 wherein said second gas manifold includes a plurality of spaced nozzles for distributing gases proximate to said wafer.

24. The reactor of claim 18 wherein said wafer support comprises a support body having a support surface for retaining said wafer;

a voltage source coupled to said support body for electrostatically coupling said wafer to said support surface;

a cooling system having a plurality of gas distribution grooves formed in said support surface and configured for-uniformly distributing a gaseous substance between said wafer and said support surface;

at least one member having two ends, one of said ends attached to said support body and the other said end attached to a surface of said process chamber.

25. The reactor of claim 24 wherein said at least one member is hollow and contains therein at least one conduit for passing cooling medium to said support body, and at least one conduit for coupling dc energy to said wafer support.

26. The reactor of claim 25 wherein said at least one member further comprises at least one conduit for coupling r.f. energy to said wafer support.

27. The reactor of claim 18 wherein said wafer support is attached to a carriage assembly, and said carriage assembly is attached to said process chamber, such that said wafer support may be removed from said process chamber.

29. The reactor of claim 28 wherein said vacuum system comprises a turbo pump.

30. The reactor of claim 28 wherein said vacuum system further comprises a vacuum isolation valve disposed between said process chamber and said pump for isolating said process chamber from said pump.

31. The reactor of claim 28 wherein said second gas manifold includes a plurality of spaced nozzles for distributing gases proximate to said wafer.

32. The reactor of claim 28 wherein said wafer support comprises a support body having a support surface for retaining said wafer;

a voltage source coupled to said support body for electrostatically coupling said wafer to said support surface;

a cooling system having a plurality of gas distribution grooves formed in said support surface and configured for uniformly distributing a gaseous substance between said wafer and said support surface;

at least one member having two ends, one of said ends attached to said support body and the other said end attached to a surface of said process chamber.

33. The reactor of claim 32 wherein said at least one member is hollow and contains therein at least one conduit for passing cooling medium to said support body, and at least one conduit for coupling dc energy to said wafer support.

34. The reactor of claim 32 wherein said at least one member further comprises at least one conduit for coupling r.f. energy to said wafer support.

35. The reactor of claim 28 wherein said wafer support is attached to a carriage assembly, and said carriage assembly is attached to said process chamber, such that said wafer support may be removed from said process chamber.

38. The process of claim 37 including the additional step of introducing at least one gaseous chemical into said process chamber proximate to said wafer support,

whereby said at least one gaseous chemical and the plasma interact proximate said wafer support to deposit a layer of material on the wafer.

39. The process of claim 37 including the additional step of introducing at least one gaseous chemical into said process chamber proximate to said wafer support, and said plasma chamber, whereby said at least one gaseous chemical and the plasma interact proximate said wafer support to deposit a layer of material on the wafer.

40. The process of claim 37 including the additional step of introducing at least one gaseous chemical into said process chamber, whereby said at least one gaseous chemical and the plasma interact proximate said wafer support to etch the surface of the wafer.

41. The process of claim 37 including the additional step of introducing at least one gaseous chemical into said process chamber and said plasma chamber, whereby said at least one gaseous chemical and the plasma interact proximate said wafer support to etch the surface of the.wafer.

42. The method of claim 37 wherein the step of referencing the plasma further comprises providing a connection to electrical ground to said top surface and creating a potential in the range of substantially 10 to 30 Volts at said top plate.

43. The method of claim 37 wherein the step of applying r.f. energy to said wafer support further comprises applying said r.f. energy in the range of substantially 1 to 60 MHz.

44. The method of claim 37 wherein the step of applying r.f. energy to said wafer support further comprises applying said r.f. energy at approximately 3.39.

45. The process of claim 37 including the additional step of introducing at least one gaseous chemical into said plasma chamber, whereby said at least one gaseous chemical extends into said process chamber and cleans the surfaces of said plasma and process chambers.

46. The reactor of claim 9 wherein said at least one member is hollow and contains therein at least one conduit for passing cooling medium to said support body, and at least one conduit for coupling dc energy to said wafer support.

47. The reactor of claim 33 wherein said at least one member fuher comprises at least one conduit for coupling r.f. energy to said wafer support.

7. The reactor of clam 1 wherein said second gas manifold includes a plurality of spaced nozzles for distributing gases proximate to said wafer.

14. A plasma enhanced CVD system, comprising:

a plasma chamber having a source of electromagnetic energy, said source having a helical resonator and a capacitive shield disposed within said helical resonator for generating a plasma,

a process chamber communicating with said plasma chamber whereby the plasma extends into said process chamber, and

a support, in said processing chamber, for supporting a wafer for interaction with the plasma extending into the process chamber.

15. A plasma enhanced CVD system comprising:

a cylindrical plasma chamber having a source of electromagnetic energy for generating a plasma;

a cylindrical process chamber communicating with said plasma chamber whereby the plasma extends into said process chamber,

a support, in said processing chamber, for supporting a wafer for interaction with the plasma extending into said process chamber; and

a vacuum system positioned on the axis of said process chamber for exhausting said process chamber.

18. A plasma enhanced CVD system, comprising:

a plasma chamber;

a first gas injection manifold communicating with said plasma chamber for receiving at least one first gas;

a source of electromagnetic energy for exciting said at least one first gas to form a plasma;

a process chamber communicating with the plasma chamber whereby the plasma extends into said process chamber;

a wafer support for supporting a wafer, said wafer support being substantially axially aligned with said process chamber;

a second gas manifold, said second gas manifold being substantially axially aligned with said process chamber and encircling said wafer support, for directing reactive gases towards said wafer support whereby the reactive gases interact with the plasma and deposit a material on the wafer; and

a vacuum system substantially axially aligned with said process chamber for removing gases from said process chamber.

28. A plasma enhanced chemical processing reactor, comprising:

a cylindrical plasma chamber;

a first gas injection manifold comnmunicating with said plasma chamber for receiving at least one first gas;

a source of electromagnetic energy having a helical resonator and a capacitive shield disposed within said helical resonator, for exciting said at least one first gas to form a plasma;

a cylindrical process chamber communicating with the plasma chamber whereby the plasma extends into said process chamber;

a wafer support for supporting a wafer, said wafer support disposed on axis within said process chamber and attached to at least one surface of said process chamber such that said wafer support is suspended within said process chamber;

a second gas manifold, disposed on axis within said process chamber and encircling said wafer support, for directing reactive gases towards said wafer support whereby the reactive gases interact with the plasma and deposit a material on the wafer; and

a vacuum system communicating with said process chamber and disposed beneath said wafer support, substantially aligned on axis with said process chamber for removing gases from said process chamber.

36. The reactor of clam 28 wherein said first gas manifold comprises at least one plenum formed therein for discretely receiving at least one gaseous chemical;

and

a plurality of holes communicating with each of said at least one plenum and said holes disposed along said plenum, for discretely distributing said at least one gaseous chemical to said plasma chamber.

37. A method of operating a plasma enhanced chemical processing reactor, having a plasma chamber and a process chamber, said process chamber including a wafer support for supporting a wafer disposed within said process chamber, comprising the steps of:

generating a plasma within a plasma chamber, said plasma chamber having a top surface;

referencing the plasma to a first voltage potential along said top surface;

applying r.f. energy to said wafer support thereby creating a second voltage potential, wherein the difference between said first voltage potential. and said second voltage potential induces diffusion of the plasma to the area proximate to said wafer support.