Injection molded heat dissipation device
First Claim
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1. A heat dissipation device, comprising:
- a first highly thermally conductive portion; and
a second thermally conductive portion abutting said first highly thermally conductive portion with a molded interface.
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Accused Products
Abstract
Heat dissipation devices and molding processes for fabricating such devices, which have at least two regions comprising different conductive materials such that efficient thermal contact is made between the different conductive materials. The molding processes include injection molding at least two differing conductive materials.
5 Citations
28 Claims
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1. A heat dissipation device, comprising:
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a first highly thermally conductive portion; and
a second thermally conductive portion abutting said first highly thermally conductive portion with a molded interface. - View Dependent Claims (2, 3, 4, 5)
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6. A microelectronic assembly, comprising:
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a microelectronic die;
a heat dissipation device abutting said microelectronic die, wherein said heat dissipation device comprises;
a first highly thermally conductive portion; and
a second thermally conductive portion abutting said first highly thermally conductive portion with a molded interface. - View Dependent Claims (7, 8, 9, 10, 11, 12, 14, 15, 16, 17, 18, 19, 20)
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13. A method of fabricating a heat dissipation device, comprising:
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providing a first mold having a cavity defined therein and having a contact surface;
providing a mold core having a contact surface and at least one first gate extending therethrough, and at least one second gate extending therethrough, said mold core first gate and said mold core second gate each having at least one opening at said mold core contact surface;
abutting said first mold contact surface against said mold core contact surface such that said at least one mold core first gate opening is position within said first mold cavity;
injecting a high thermal conductivity material through said at least one mold core first gate to fill said first mold cavity to form a highly thermally conductive portion;
removing said first mold;
providing a second mold having a cavity defined therein and having a contact surface;
abutting said second mold contact surface against said mold core contact surface such that at least one mold core second gate opening is positioned within said second mold cavity, and such that said second mold cavity encompasses at least a portion of said highly thermally conductive portion;
injecting a thermal conductive material through said at least one mold core second gate into said second mold cavity to form a second conductive portion; and
removing said highly thermally conductive portion and said second conductive portion from said second mold.
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21. A method of fabricating a heat dissipation device, comprising:
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providing a mold having a cavity defined therein and having a contact surface;
providing a mold core having a contact surface and at least one gate extending therethrough, said at least one mold core gate having at least one opening at said mold core contact surface;
abutting said mold contact surface against said mold core contact surface such that at least one mold core gate opening is position within said mold cavity;
injecting a thermal conductive material through said at least one mold core gate into said mold cavity;
injecting a high thermal conductivity material through said at least one mold core gate to form a highly thermally conductive portion; and
removing said highly thermally conductive portion and said second conductive portion from said mold. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28)
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Specification