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Injection molded heat dissipation device

  • US 20020079613A1
  • Filed: 12/27/2000
  • Published: 06/27/2002
  • Est. Priority Date: 12/27/2000
  • Status: Active Grant
First Claim
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1. A heat dissipation device, comprising:

  • a first highly thermally conductive portion; and

    a second thermally conductive portion abutting said first highly thermally conductive portion with a molded interface.

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