Apparatus and methods for handling semiconductor wafers
First Claim
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1. An apparatus for handling wafers, comprising:
- an end effector including at least one arm;
a flexure joint; and
a force element.
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Abstract
Disclosed are apparatus and methods used for handling semiconductor wafers or similar articles. In particular, the apparatus disclosed are capable of flexibly gripping items of various shapes and sizes. The apparatus is particularly suited to being used as a robotic end effector for handling wafers using edge-gripping techniques.
383 Citations
12 Claims
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1. An apparatus for handling wafers, comprising:
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an end effector including at least one arm;
a flexure joint; and
a force element. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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- 8. The apparatus of claim 8, wherein the second arm is arcuate.
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11. A method of handling wafers comprising the steps of:
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moving an end effector into contact with a wafer; and
applying a force to the end effector, thereby causing a flexure joint to flex and at least one arm of the end effector to rotate in a direction away from the wafer, and wherein the applied force moves the end effector around the wafer. - View Dependent Claims (12)
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Specification