Novel polymers and photoresist compositions for short wavelength imaging

• US 20020081499A1
• Filed: 11/26/2001
• Published: 06/27/2002
• Est. Priority Date: 11/26/2000
• Status: Active Grant

• Current Assignee: Shipley Company, LLC (Dow, Inc.)
• Original Assignee: Shipley Company, LLC (Dow, Inc.)
• Inventors: Cho, Sungseo, Zampini, Anthony
• Granted Patent: US 6,844,270 B2
• Time in Patent Office: Days
• US Class Current: 430/5
• CPC Class Codes: G03F 7/0392 the macromolecular compound being present in a chemically amplified positive photoresist composition
• CPC Class Codes: H01L 21/0271 comprising organic layers
• CPC Class Codes: Y10S 438/948 Radiation resist

Abstract

The present invention includes polyacetal polymers and photoresist compositions that comprise the polymers as a resin binder component. Photoresists of the invention include chemically-amplified positive-acting resists that can be effectively imaged at short wavelengths such as sub-300 nm, particularly 157 nm.

Claims