Inspection analyzing apparatus and semiconductor device
First Claim
Patent Images
1. An inspection analyzing method comprising the steps of:
- (a) providing one or more monitor wafers for each of a plurality of processing steps individually performed by a plurality of processing apparatuses;
(b) performing an inspection on said one or more monitor wafers to obtain an inspection result; and
(c) assigning said inspection result an identification name for identifying each of said plurality of processing apparatuses having performed said plurality of said processing steps in said step (a) on said one or more monitor wafers subjected to said inspection by which said inspection result is obtained, and storing said inspection result.
2 Assignments
0 Petitions
Accused Products
Abstract
A monitor wafer is processed by a processing apparatus, and thereafter, it is subjected to an inspection in a foreign object inspection apparatus in accordance with an inspection recipe. A measured result obtained by the inspection is compiled and analyzed in a data management system. Generally, a monitor wafer is not assigned a rot name or a wafer name, however, the measured result is assigned an identification name for identifying plural processing apparatuses from one another, and is stored in a database as storage data.
-
Citations
18 Claims
-
1. An inspection analyzing method comprising the steps of:
-
(a) providing one or more monitor wafers for each of a plurality of processing steps individually performed by a plurality of processing apparatuses;
(b) performing an inspection on said one or more monitor wafers to obtain an inspection result; and
(c) assigning said inspection result an identification name for identifying each of said plurality of processing apparatuses having performed said plurality of said processing steps in said step (a) on said one or more monitor wafers subjected to said inspection by which said inspection result is obtained, and storing said inspection result. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 13, 15, 16, 17)
-
-
11. An inspection analyzing method, comprising the steps of:
-
(a) performing a plurality of inspections on a wafer to be processed in a first processing step which is executed by a first processing apparatus;
(b) performing an inspection on a wafer to be processed in said first processing step and a second processing step which is executed after said first processing step; and
(c) comparing a plurality of inspection results obtained by said step (a) with an inspection result obtained by said step (b). - View Dependent Claims (12, 14, 18)
-
Specification