Generic layer transfer methodology by controlled cleavage process
First Claim
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1. A process for forming a film of material from a substrate, said process comprising steps of:
- forming a weakened region in a selected manner at a selected depth underneath said surface, to define a substrate material to be removed above said selected depth; and
providing energy to a selected region of said substrate to initiate a controlled cleaving action at said selected depth in said substrate, whereupon said cleaving action is made using a propagating cleave front to free a portion of said material to be removed from said substrate.
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Abstract
A technique for forming a film of material (12) from a donor substrate (10). The technique has a step of forming a weakened region in a selected manner at a selected depth (20) underneath the surface. An energy source is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (10) at the selected depth (20), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.
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10 Claims
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1. A process for forming a film of material from a substrate, said process comprising steps of:
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forming a weakened region in a selected manner at a selected depth underneath said surface, to define a substrate material to be removed above said selected depth; and
providing energy to a selected region of said substrate to initiate a controlled cleaving action at said selected depth in said substrate, whereupon said cleaving action is made using a propagating cleave front to free a portion of said material to be removed from said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification