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Electronic component with stacked semiconductor chips and method of producing the component

  • US 20020094607A1
  • Filed: 01/16/2002
  • Published: 07/18/2002
  • Est. Priority Date: 01/16/2001
  • Status: Active Grant
First Claim
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1. An electronic component, comprising:

  • a stack of a plurality of semiconductor chips each having an active top side and a sawn edge;

    contact areas and interconnects formed on said active top side for rewiring to contact areas of respectively adjacent semiconductor chips; and

    said interconnects connecting to said contact areas on said active top side, extending toward said sawn edge of said semiconductor chip, and connecting to said respectively adjacent semiconductor chips via through-contacts formed at said sawn edge of said semiconductor chip.

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