Integrated circuit inductors

• US 20020095776A1
• Filed: 03/18/2002
• Published: 07/25/2002
• Est. Priority Date: 07/09/1999
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Ahn, Kie Y., Forbes, Leonard
• Granted Patent: US 6,822,545 B2
• Time in Patent Office: Days
• US Class Current: 29/604
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 37/00 Fixed inductances not covered by group H01F17/00
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: Y10S 257/924 with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49037 Using reference point/surface to facilitate measuring
• CPC Class Codes: Y10T 29/49069 Data storage inductor or core
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49075 including permanent magnet or core

Abstract

The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.

Claims

1. An inductor comprising:

a substrate having a plurality of substantially parallel holes, a plurality of substantially parallel surfaces, and a second plurality of substantially parallel surfaces approximately perpendicular to the plurality of substantially parallel surfaces;

a coil intersecting the plurality of substantially parallel surfaces and filling the plurality of substantially parallel holes; and

at least two leads operable for coupling to the coil from at least one of the second plurality of substantially parallel surfaces.

2. The inductor of claim 1, wherein the substrate comprises a semiconductor.

3. The inductor of claim 1, wherein the coil comprises at least one metal conductor.

4. The inductor of claim 3, wherein the at least one metal conductor includes a metal conductor selected from the group consisting of:

aluminum, copper and gold.

5. The inductor of claim 1, wherein the coil comprises a first conductive segment subtending the substrate through the substantially parallel holes connecting the first plurality of substantially parallel surfaces, and a second conductive segment formed on the second substantially parallel surfaces and connected to the first conductive segment.

6. An inductor comprising:

a substrate with substantially parallel holes connecting first and second opposing substrate surfaces and running parallel to third and fourth opposing substrate surfaces;

a coil intersecting the first and second opposing substrate surfaces and filling the substantially parallel holes; and

at least two leads operable for coupling to the coil from at least one of the first, second, third and fourth substrate surfaces.

7. The inductor of claim 6, further including a first layer of magnetic material atop the first substrate surface.

8. The inductor of claim 7, further including a second layer of magnetic material atop the second substrate surface.

9. The inductor of claim 8, further including first and second insulating layers atop the first and second magnetic material layers, respectively.

10. The inductor of claim 8, wherein the first and second layers of magnetic material comprise a magnetic oxide.

11. The inductor of claim 9, wherein the first and second insulating layers comprise an inorganic oxide.

13. The inductor of claim 12, wherein the first and second coil segments are formed from first and second metal conductors.

14. The inductor of claim 12, wherein the first and second metal conductors are the same.

15. The inductor of claim 12, further including a sense inductor formed on a surface of the substrate and magnetically coupled to the conductive path.

16. The inductor of claim 12, further including a sense inductor embedded in the substrate and magnetically coupled to the conductive path.

17. The inductor of claim 12, further including a circuit connected to the at least two leads.

19. The inductor of claim 18, wherein the conductive path encompasses one or more layers of magnetic material.

20. The inductor of claim 19, wherein the one or more layers of magnetic material comprises a magnetic oxide.

21. The inductor of claim 19, further including one or more insulating layers encompassing the one or more layers of magnetic material.

22. The inductor of claim 19, further including a circuit connected to the at least two leads.

23. The inductor of claim 22, wherein the circuit includes memory cells.

25. The inductor of claim 24, wherein the rectangular cross-section coil surrounds one or more layers of magnetic material.

26. The inductor of claim 25, further including a first insulating layer covering the one or more layers of magnetic material.

27. The inductor of claim 26, further including a second insulating layer covering a portion of the rectangular cross-section coil.

28. The inductor of claim 24, further including a circuit connected to the at least two leads.

30. The inductor of claim 29, wherein the first and second metal conductor segments comprise the same metal conductor.

31. The inductor of claim 29, wherein the first metal conductor segment comprises aluminum or copper.

32. The inductor of claim 29, further including a circuit connected to the at least two leads.

33. The inductor of claim 29, further including:

a second set of substantially parallel holes within which is formed a portion of a sense coil magnetically coupled to the main coil.

35. The inductor of claim 34, wherein the first and second substantially horizontal parallel coils segments reside atop first and second magnetic films, respectively.

36. The inductor of claim 34, further including a circuit connected to the at least two leads.

12. An inductor comprising:

a substrate with a rectangular cross-section and upper and lower opposing surfaces;

a plurality of substantially parallel holes connecting the upper and lower surfaces;

a first coil segment formed in the plurality of holes;

a second coil segment comprising a plurality of conductive segments arranged over the upper and lower surfaces so as to connect to the first coil segments to form a conductive path; and

at least two leads operable for coupling to at least one of the first and second coil segments.

18. An inductor comprising:

a substrate having a plurality of substantially parallel holes connecting first and second opposing substrate surfaces;

a conductive path defined by first conductive segments that fill the plurality of substantially parallel holes and by second conductive segments connected to the first conductive segments so as to form a coil; and

at least two leads connected to the conductive path.

24. An inductor comprising:

a substrate;

a plurality of substantially parallel holes passing through the substrate;

a rectangular cross-section coil formed from a conductive segment that passes through the plurality of holes; and

at least two leads coupled to the rectangular cross-section coil.

29. An inductor comprising:

a substrate with a first set of substantially parallel holes connecting opposing substantially parallel substrate surfaces

first metal conductor segments formed in the plurality of holes;

second metal conductor segments connecting the first metal conductor segments to form a conductive path in the form of a main coil; and

at least two leads operable for coupling to at least one of the first and second metal conductor segments.

34. An inductor comprising:

a semiconductor substrate having a rectangular cross-section and opposing upper and lower surfaces;

a plurality of substantially parallel holes connecting the upper and lower surfaces;

a conductive path comprising vertical conductive segments of material that fill the plurality of substantially parallel holes;

first substantially horizontal parallel coil segments arranged on the lower surface that connect the vertical conductive segments;

second substantially horizontal parallel coil segments arranged on the upper surface that connect the vertical conductive segments to form a conductive coil; and

at least two leads operable for coupling to at least one of the first and second coil segments.