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Surface preparation prior to deposition

  • US 20020098627A1
  • Filed: 08/31/2001
  • Published: 07/25/2002
  • Est. Priority Date: 11/24/2000
  • Status: Active Grant
First Claim
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1. A method of depositing a film over a surface in a partially fabricated integrated circuit, comprising exposing the surface to products of a plasma, thereby modifying termination of the surface without significantly affecting bulk properties beneath the surface, and depositing a layer thereover after modifying the surface termination.

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