System and method for modulated ion-induced atomic layer deposition (MII-ALD)

• US 20020104481A1
• Filed: 03/19/2001
• Published: 08/08/2002
• Est. Priority Date: 12/06/2000
• Status: Abandoned Application

• Current Assignee: Angstron Systems, Inc. (LAM Research Corporation)
• Original Assignee: Angstron Systems, Inc. (LAM Research Corporation)
• Inventors: Leeser, Karl F., Chiang, Tony P.
• Application Number:
  US09/812,352
• Publication Number:
  US 20020104481A1
• Time in Patent Office: Days
• US Class Current: 118/723I
• CPC Class Codes: C23C 16/0227 by cleaning or etching
• CPC Class Codes: C23C 16/08 from metal halides
• CPC Class Codes: C23C 16/34 Nitrides C23C16/303 takes precedence
• CPC Class Codes: C23C 16/401 containing silicon
• CPC Class Codes: C23C 16/45525 Atomic layer deposition [ALD]
• CPC Class Codes: C23C 16/45538 Plasma being used continuously during the ALD cycle
• CPC Class Codes: C23C 16/45544 characterized by the apparatus
• CPC Class Codes: C23C 16/46 characterised by the method used for heating the substrate C23C16/48, C23C16/50 take precedence
• CPC Class Codes: C23C 16/463 Cooling of the substrate
• CPC Class Codes: C23C 16/466 using thermal contact gas
• CPC Class Codes: C23C 16/481 by radiant heating of the substrate
• CPC Class Codes: C23C 16/483 using coherent light, UV to IR, e.g. lasers
• CPC Class Codes: C23C 16/511 using microwave discharges
• CPC Class Codes: H01L 21/28562 Selective deposition
• CPC Class Codes: H01L 21/76843 formed in openings in a dielectric
• CPC Class Codes: H01L 21/76871 Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers

Abstract

The present invention relates to an enhanced sequential or non-sequential atomic layer deposition (ALD) apparatus and technique suitable for deposition of barrier layers, adhesion layers, seed layers, low dielectric constant (low-k) films, high dielectric constant (high-k) films, and other conductive, semi-conductive, and non-conductive films. This is accomplished by 1) providing a non-thermal or non-pyrolytic means of triggering the deposition reaction; 2) providing a means of depositing a purer film of higher density at lower temperatures; 3) providing a faster and more efficient means of modulating the deposition sequence and hence the overall process rate resulting in an improved deposition method; and, 4) providing a means of improved radical generation and delivery.

It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. [37 C.F.R. § 1.72(b)].

Claims

1. A system for ion-induced deposition of a film onto a substrate, said system comprising:

a main chamber containing a plasma generation chamber for generating a plasma;

said main chamber also containing a deposition chamber for depositing said film on said substrate;

a distribution showerhead located between said plasma generation chamber and said deposition chamber;

said plasma generation chamber coupled to receive at least one feed gas to form said plasma for generation of ions;

said plasma generation chamber also coupled to receive at least one feed gas to react with said plasma for generation of radicals; and

said deposition chamber coupled to receive at least one precursor gas to react with said ions and said radicals to form said film on said substrate.

2. The system of claim 1, wherein said deposition chamber is coupled to an evacuation means capable of bringing said deposition chamber to a subatmospheric pressure.

3. The system of claim 1, wherein said plasma generation chamber is in communication with an energy source through a dielectric window.

4. The system of claim 3, wherein said distribution showerhead shields said dielectric window from being coated by said deposition chamber precursor gas.

5. The system of claim 1 further comprising a substrate holder located in said deposition chamber, said substrate holder electrically biasing said substrate via a power supply.

6. The system of claim 1, further comprising a mechanical shutter which can occlude ions produced by said plasma generation chamber from reaching said substrate located in said deposition chamber.

7. The system of claim 1, wherein a pressure within said plasma generation chamber is greater than a pressure in said deposition chamber.

8. The system of claim 7, wherein a pressure within said plasma generation chamber is greater than ten times a pressure in said deposition chamber.

9. The system of claim 1, wherein a plasma generated in said plasma generation chamber does not intermingle with said deposition chamber precursor gas.

10. The system of claim 1, wherein said plasma generation chamber comprises a point source.

11. The system of claim 1, further comprising a means for providing a relative movement between a source of said ions and said substrate.

13. The system of claim 12, wherein said deposition chamber is coupled to an evacuation means capable of bringing said deposition chamber to a subatmospheric pressure.

14. The system of claim 12, wherein said plasma generation chamber is in communication with an energy source through a dielectric window.

15. The system of claim 14, wherein said distribution showerhead shields said dielectric window from being coated by said deposition chamber precursor gas.

16. The system of claim 14, wherein said energy source is a radio frequency source.

17. The system of claim 16, wherein said communication is via inductive coupling to said radio frequency source using at least one solenoidal coil.

18. The system of claim 14, wherein said energy source is a microwave source.

19. The system of claim 18, wherein said communication is via coupling to said microwave source via a coaxial cable.

20. The system of claim 18, wherein said communication is via coupling to said microwave source via a waveguide.

21. The system of claim 12 further comprising a substrate holder located in said deposition chamber, said substrate holder electrically biasing said substrate via a power supply.

22. The system of claim 21, wherein said power supply has a variable voltage.

23. The system of claim 21, wherein said power supply has a variable duty cycle.

24. The system of claim 21, wherein said power supply supplies a direct current bias to said substrate.

25. The system of claim 21, wherein said power supply supplies a radio frequency bias to induce a negative potential on said substrate.

26. The system of claim 25, wherein a periodicity of said electrical bias is from 0.1 Hz to 20 MHz.

27. The system of claim 25, wherein a periodicity of said electrical bias is from 100 Hz to 10 kHz.

28. The system of claim 12, further comprising a mechanical shutter which can occlude ions produced by said plasma generation chamber from reaching said substrate located in said deposition chamber.

29. The system of claim 12, wherein said distribution showerhead is comprised of one or more apertures.

30. The system of claim 29, wherein at least one aperture of said one or more apertures has dimensions through which radicals may pass.

31. The system of claim 29, wherein at least one aperture of said one or more apertures has dimensions through which ions may pass.

32. The system of claim 29, wherein dimensions and location of said one or more apertures are optimized to provide uniform exposure of said substrate.

33. The system of claim 29, wherein dimensions and location of said one or more apertures are optimized to provide for a desired ion to radical ratio.

34. The system of claim 12, wherein a deposition reaction is controlled via ion-imparted kinetic energy.

35. The system of claim 12, further comprising a thermal heating element to control said film deposition on said substrate.

36. The system of claim 35, wherein said thermal heating element maintains said substrate at a temperature of less than about 350°

C.

37. The system of claim 35, wherein said thermal heating element maintains said substrate at a temperature at approximately room temperature.

38. The system of claim 12, wherein a pressure within said plasma generation chamber is greater than a pressure in said deposition chamber.

39. The system of claim 12, wherein a pressure within said plasma generation chamber is greater than ten times a pressure in said deposition chamber.

40. The system of claim 12, wherein a distance from said distribution showerhead to said substrate is less than twice a width of said substrate.

41. The system of claim 12, wherein a distance from said distribution showerhead to said substrate is at least one-half a width of said substrate.

42. The system of claim 12, wherein a plasma generated in said plasma generation chamber does not intermingle with said deposition chamber precursor gas.

43. The system of claim 12, wherein a plasma generated in said plasma generation chamber is not in direct communication with said substrate.

44. The system of claim 12, wherein said plasma generation chamber comprises a point source.

45. The system of claim 12, further comprising a means for providing a relative movement between a source of said ions and said substrate.

47. The system of claim 46, wherein said plasma generation chamber coupled to said plasma generation source is by a dielectric window.

48. The system of claim 46, wherein said distribution showerhead is located between said plasma generation chamber and said deposition chamber.

49. The system of claim 46, wherein said plasma generated by said plasma generation chamber is used to dissociate feed gases to generate ions and radicals.

50. The system of claim 49, further including a mechanical shutter for periodically occluding said ions.

51. The system of claim 46, wherein said plasma generation source is a radio frequency source.

52. The system of claim 51, wherein an impedance matching device is coupled to said radio frequency source and to said plasma generation chamber.

53. The system of claim 46, wherein said plasma generation source is a microwave source.

54. The system of claim 53, wherein said plasma generation chamber is coupled to said microwave source via a coaxial cable.

55. The system of claim 53, wherein said plasma generation chamber is coupled to said microwave source via a waveguide.

56. The system of claim 46, wherein said plasma generation source may be modulated by a change selected from a group consisting of a change in frequency, a change in power magnitude, and a change in duty-cycle.

57. The system of claim 46, wherein said plasma generation chamber comprises a point source.

58. The system of claim 46, further comprising a means for providing a relative movement between a source of said ions and said substrate.

60. The method of claim 59, wherein said reactant gas is an organometallic.

61. The method of claim 59, wherein said radical generating feed gas is selected from the group consisting of H₂, O₂, N₂, NH₃, and H₂O vapor.

62. The method of claim 59, wherein said generated radicals are selected from a group consisting of hydrogen atoms, nitrogen atoms, oxygen atoms, OH molecules, and NH molecules.

63. The method of claim 59, wherein said ion generating feed gas is selected from a group consisting of Argon, Krypton, Neon, and Xenon.

64. The method of claim 59, wherein said generated ions are selected from a group consisting of Ar⁺, Kr⁺, Ne⁺, and Xe⁺.

65. The method of claim 59, further comprising exposing said substrate to at least one additional reactant gas.

66. The method of claim 59, wherein said substrate is simultaneously exposed to said ions and said radicals.

67. The method of claim 59, wherein said substrate is exposed to said ions after exposure to said radicals.

68. The method of claim 59, further comprising electrically biasing said substrate to a negative potential relative to ground.

69. The method of claim 59, further comprising said ions and said radicals removing unwanted impurities from said substrate prior to said adsorption of said monolayer of the first reactant.

70. The method of claim 59, further comprising said ions and said radicals removing unwanted impurities from said monolayer during said film deposition reaction.

71. The method of claim 59, wherein said ion modulation is modulated in a way selected from the group consisting of modulating an ion flux and modulating an ion energy.

72. The method of claim 71, wherein modulation in said ion flux is modulated in a way selected from the group consisting of modulating a flow of said ion generating feed gas, modulating a power of said plasma, modulating said exposure to said ions, and modulating the relative movement between said plasma and said substrate.

73. The method of claim 59, wherein said method is repeated until the film achieves a desired thickness.

12. A system for isolating a plasma when depositing a film onto a substrate comprising:

a main chamber containing a plasma generation chamber for generating said plasma and a deposition chamber for depositing said film;

a distribution showerhead located between said plasma generation chamber and said deposition chamber;

said plasma generation chamber coupled to receive at least one feed gas for ion generation and at least one feed gas for radical generation; and

said deposition chamber coupled to receive at least one precursor gas.

46. A system for generating a plasma for depositing a film onto a substrate, said system comprising:

a plasma generation source;

a plasma generation chamber coupled to said plasma generation source;

a deposition chamber; and

a distribution showerhead separating said plasma generation chamber from said deposition chamber.

59. A method for depositing a film onto a substrate in an evacuated chamber comprising:

introducing at least one ion generating feed gas into said chamber;

introducing at least one radical generating gas into said chamber;

generating a plasma;

generating ions from said ion generating feed gas and said plasma;

generating radicals from said radical generating gas and said plasma;

introducing at least one reactant gas into said chamber;

adsorbing at least one monolayer of said reactant gas on said substrate;

exposing said substrate to said ions and said radicals;

modulating said ions; and

reacting said monolayer with said ions and said radicals to deposit said film.