Across-wafer optical MEMS device and protective lid having across-wafer light-transmissive portions
First Claim
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1. An across-wafer optical microelectromechanical system comprising:
- (a) a substrate having a first surface;
(b) an across-wafer optical MEMS device attached to the first surface for selectively altering the flow of light in a direction parallel to the first surface; and
(c) a protective lid for covering the optical MEMS device, the lid including first and second light-transmissive portions for providing an optical path in a direction parallel to the first surface.
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Abstract
An across-wafer optical MEMS device includes a protective lid having across-wafer light-transmissive portions. The across-wafer optical MEMS device allows light to pass in a direction substantially parallel to a surface on which the optical MEMS device is mounted. The light-transmissive portions in the protective lid allow light to pass from an optical device located on one side of the optical MEMS device to a second device located on another side of the optical MEMS device. A plurality of optical MEMS devices can be located on the substrate and enclosed by the same lid without wafer-level encapsulation of each optical MEMS device.
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Citations
47 Claims
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1. An across-wafer optical microelectromechanical system comprising:
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(a) a substrate having a first surface;
(b) an across-wafer optical MEMS device attached to the first surface for selectively altering the flow of light in a direction parallel to the first surface; and
(c) a protective lid for covering the optical MEMS device, the lid including first and second light-transmissive portions for providing an optical path in a direction parallel to the first surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. An across-wafer optical mircoelectromechanical system comprising:
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(a) a substrate having a first surface;
(b) an across-wafer optical MEMS device located on the first surface for selectively altering the flow of light in a direction parallel to the first surface; and
(c) a protective lid for covering the optical MEMS device, wherein at least one of the substrate and the lid include first and second light-transmissive portions for providing an optical path. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 40, 41, 42, 43, 44, 45, 46, 47)
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39. A method for passing light through an optical MEMS device package in across-wafer direction, the method comprising:
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(a) passing light through a first light-transmissive portion of an optical MEMS device package;
(b) guiding the light in a direction substantially parallel to a surface of a substrate to which an optical MEMS device is attached;
(c) selectively altering the flow of light across the first surface using the optical MEMS device; and
(d) passing the light from the optical MEMS device package through a second light-transmissive portion.
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Specification