Across-wafer optical MEMS device and protective lid having across-wafer light-transmissive portions

• US 20020104990A1
• Filed: 12/19/2001
• Published: 08/08/2002
• Est. Priority Date: 12/19/2000
• Status: Abandoned Application

• Current Assignee: Coventor, Inc. (Lam Research Corporation)
• Original Assignee: Coventor, Inc. (Lam Research Corporation)
• Inventors: DeReus, Dana Richard, Cunningham, Shawn Jay, Morris, Arthur S.
• Application Number:
  US10/025,978
• Publication Number:
  US 20020104990A1
• Time in Patent Office: Days
• US Class Current: 257/20
• CPC Class Codes: B81B 2201/038 Microengines and actuators not provided for in B81B2201/031 - B81B2201/037
• CPC Class Codes: B81B 2201/045 Optical switches
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81B 2203/051 Translation according to an axis parallel to the substrate
• CPC Class Codes: B81B 3/0051 For defining the movement, i.e. structures that guide or limit the movement of an element mechanical arrangements for preventing or damping vibration or shock H01H3/60
• CPC Class Codes: B81B 7/0067 for controlling the passage of optical signals through the package
• CPC Class Codes: B81C 1/00182 Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: G02B 26/085 the reflecting means being moved or deformed by electromagnetic means
• CPC Class Codes: G02B 26/0858 the reflecting means being moved or deformed by piezoelectric means
• CPC Class Codes: G02B 26/0866 the reflecting means being moved or deformed by thermal means
• CPC Class Codes: G02B 6/3512 the optical element being reflective, e.g. mirror
• CPC Class Codes: G02B 6/353 the optical element being a shutter, baffle, beam dump or opaque element absorbers on light guide termination G02B6/243
• CPC Class Codes: G02B 6/3548 1xN switch, i.e. one input and a selectable single output of N possible outputs
• CPC Class Codes: G02B 6/356 in an optical cross-connect device, e.g. routing and switching aspects of interconnecting different paths propagating different wavelengths to (re)configure the various input and output links switching polarized beams G02B6/3594; power equalizers G02B6/356 and G02B6/3594; path selecting means H04Q11/0001
• CPC Class Codes: G02B 6/3566 involving bending a beam, e.g. with cantilever
• CPC Class Codes: G02B 6/357 Electrostatic force electrostatic forces controlling reflecting elements in general G02B26/0841
• CPC Class Codes: G02B 6/3572 Magnetic force magnetic forces controlling reflecting elements in general G02B26/085; magneto-optic devices G02F1/09
• CPC Class Codes: G02B 6/3576 : Temperature or heat actuation thermal forces controlling reflecting elements in general G02B26/0866; thermo-optic devices G02F1/0147
• CPC Class Codes: G02B 6/3578 : Piezoelectric force piezoelectric forces controlling reflecting elements in general G02B26/0858; piezo-optic devices G02F1/0131
• CPC Class Codes: G02B 6/3582 : Housing means or package or arranging details of the switching elements, e.g. for thermal isolation
• CPC Class Codes: G02B 6/3584 : constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching MEMS per se B81B, B81C
• CPC Class Codes: H01H 2001/0052 : Special contact materials used for MEMS
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An across-wafer optical MEMS device includes a protective lid having across-wafer light-transmissive portions. The across-wafer optical MEMS device allows light to pass in a direction substantially parallel to a surface on which the optical MEMS device is mounted. The light-transmissive portions in the protective lid allow light to pass from an optical device located on one side of the optical MEMS device to a second device located on another side of the optical MEMS device. A plurality of optical MEMS devices can be located on the substrate and enclosed by the same lid without wafer-level encapsulation of each optical MEMS device.

Claims

1. An across-wafer optical microelectromechanical system comprising:

(a) a substrate having a first surface;

(b) an across-wafer optical MEMS device attached to the first surface for selectively altering the flow of light in a direction parallel to the first surface; and

(c) a protective lid for covering the optical MEMS device, the lid including first and second light-transmissive portions for providing an optical path in a direction parallel to the first surface.

2. The system of claim 1 wherein the substrate comprises a glass material.

3. The system of claim 1 wherein the substrate comprises a silicon material.

4. The system of claim 1 wherein the substrate comprises a gallium arsenide material.

5. The system of claim 1 wherein the across-wafer optical MEMS device comprises an elongate member having a curling portion for curling out of the plane of the first surface to alter the flow of light across the substrate.

6. The system of claim 1 wherein the across-wafer optical MEMS device comprises a sliding member for sliding across the first surface to alter the flow of light across the substrate.

7. The system of claim 1 wherein the across-wafer optical MEMS device comprises:

(a) a pedestal;

(b) an elongate member torsionally mounted on the pedestal; and

(c) an actuation electrode located below the elongate member for pivoting the elongate member about the pedestal selectively alter the flow of light across the substrate.

8. The system of claim 1 wherein the across-wafer optical MEMS device comprises a pop-up member for moving from a first position substantially parallel to the plane of the first surface to a second position substantially orthogonal to the plane of the first surface to selectively affect the flow of light across the substrate.

9. The system of claim 1 wherein the optical across-wafer MEMS device comprises a cantilever beam having a mirror mounted on an end of the cantilever beam for selectively affecting the flow of light across the substrate.

10. The system of claim 1 wherein the across-wafer optical MEMS device comprises an elongate member extending in a direction orthogonal to the first surface of the substrate and a pivot for rotationally mounting the elongate member on the substrate, wherein the elongate member rotates about the pivot to selectively affect the flow of light across the substrate.

11. The system of claim 1 wherein the across-wafer optical MEMS device comprises a bi-metallic spring having a resting position for affecting the flow of light across the substrate and an actuated position for allowing light to pass across the substrate.

12. The system of claim 11 wherein the bi-metallic spring includes a piezoelectric material for moving the spring from the resting position to the actuated position.

13. The system of claim 11 wherein the bi-metallic spring includes a magnetic material for moving the spring from the first position to the actuated position.

14. The system of claim 1 comprising a plurality of across-wafer optical MEMS devices located on the substrate for affecting the flow of light across the first surface.

15. The system of claim 1 wherein the protective lid is made of the same material as the substrate.

16. The system of claim 1 wherein the protective lid is made from a different material than the substrate.

17. The system of claim 1 wherein the first and second light-transmissive portions comprise apertures.

18. The system of claim 1 wherein the first and second light-transmissive portions comprise a light-transmissive material.

19. The system of claim 18 comprising an anti-reflective film located on predetermined surfaces of the light-transmissive portions.

20. An across-wafer optical mircoelectromechanical system comprising:

(a) a substrate having a first surface;

(b) an across-wafer optical MEMS device located on the first surface for selectively altering the flow of light in a direction parallel to the first surface; and

(c) a protective lid for covering the optical MEMS device, wherein at least one of the substrate and the lid include first and second light-transmissive portions for providing an optical path.

21. The system of claim 20 wherein the substrate comprises a glass material.

22. The system of claim 20 wherein the substrate comprises a silicon material.

23. The system of claim 20 wherein the substrate comprises a gallium arsenide material.

24. The system of claim 20 wherein the across-wafer optical MEMS device comprises an elongate member having a curling portion for curling out of the plane of the first surface to alter the flow of light across the substrate.

25. The system of claim 20 wherein the across-wafer optical MEMS device comprises a sliding member for sliding across the first surface to alter the flow of light across the substrate.

26. The system of claim 20 wherein the across-wafer optical MEMS device comprises:

(a) a pedestal;

(b) an elongate member torsionally mounted on the pedestal; and

(c) an actuation electrode located below the elongate member for pivoting the elongate member about the pedestal selectively alter the flow of light across the substrate.

27. The system of claim 20 wherein the across-wafer optical MEMS device comprises a pop-up member for moving from a first position substantially parallel to the plane of the first surface to a second position substantially orthogonal to the plane of the first surface to selectively affect the flow of light across the substrate.

28. The system of claim 20 wherein the across-wafer optical MEMS device comprises a cantilever beam having a mirror mounted on an end of the cantilever beam for selectively affecting the flow of light across the substrate.

29. The system of claim 20 wherein the across-wafer optical MEMS device comprises an elongate member extending in a direction orthogonal to the first surface of the substrate and a pivot for rotationally mounting the elongate member on the substrate, wherein the elongate member rotates about the pivot to selectively affect the flow of light across the substrate.

30. The system of claim 20 wherein the across-wafer optical MEMS device comprises a bi-metallic spring having a resting position for affecting the flow of light across the substrate and an actuated position for allowing light to pass across the substrate.

31. The system of claim 30 wherein the bi-metallic spring includes a piezoelectric material for moving the spring from the resting position to the actuated position.

32. The system of claim 30 wherein the bi-metallic spring includes a magnetic material for moving the spring from the first position to the actuated position.

33. The system of claim 20 comprising a plurality of across-wafer optical MEMS devices located on the substrate for affecting the flow of light across the first surface.

34. The system of claim 20 wherein the protective lid is made of the same material as the substrate.

35. The system of claim 20 wherein the protective lid is made from a different material than the substrate.

36. The system of claim 20 wherein the first and second light-transmissive portions comprise apertures.

37. The system of claim 20 wherein the first and second light-transmissive portions comprise a light-transmissive material.

38. The system of claim 20 comprising an anti-reflective film located on predetermined surfaces of the light-transmissive portions.

40. The method of claim 39 wherein passing the light through a first light-transmissive portion includes passing the light through an aperture.

41. The method of claim 39 wherein passing the light through a first light-transmissive portion includes passing the light through a light-transmissive material.

42. The method of claim 39 wherein guiding the light in a direction substantially parallel to a surface of a substrate includes guiding the light through a cavity formed by the optical MEMS device package.

43. The method of claim 39 wherein selectively altering the flow of light across the first surface includes reflecting the light as it passes across the first surface.

44. The method of claim 39 wherein selectively altering the flow of light as it passes across the first surface includes changing the wavelength content of the light as it passes across the first surface.

45. The method of claim 39 wherein selectively altering the flow of light as it passes across the first surface includes selectively blocking the light as it passes across the first surface.

46. The method of claim 39 wherein passing the light from the optical MEMS device through a second light-transmissive portion includes passing the light through an aperture.

47. The method of claim 39 wherein passing the light from the optical MEMS device through a second light-transmissive portion includes passing the light through a light-transmissive material.

39. A method for passing light through an optical MEMS device package in across-wafer direction, the method comprising:

(a) passing light through a first light-transmissive portion of an optical MEMS device package;

(b) guiding the light in a direction substantially parallel to a surface of a substrate to which an optical MEMS device is attached;

(c) selectively altering the flow of light across the first surface using the optical MEMS device; and

(d) passing the light from the optical MEMS device package through a second light-transmissive portion.