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Multi-layer interconnect module and method of interconnection

  • US 20020105083A1
  • Filed: 02/01/2002
  • Published: 08/08/2002
  • Est. Priority Date: 09/28/2000
  • Status: Active Grant
First Claim
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1. A multi-layer microwave interconnect module having a top surface and a bottom surface and comprising:

  • four metal layers separated by a plurality of dielectric layers including a top signal layer on the top surface, a bottom metal layer on the bottom surface, an internal ground layer, and an internal signal layer, the top signal layer providing contacts for electrical components mounted on the module, the internal signal layer providing a metal trace for cooperating with the internal ground layer as a microstrip, and the bottom metal layer providing a bottom ground plane and at least one input/output contact, and conductive vias selectively connecting at least one contact in the top signal layer to the bottom ground plane, at least one contact from the top signal layer to the at least one input/output contact, and contacts in the top signal layer to the metal trace in the internal signal layer, the conductive vias extending from the top surface to the bottom surface for ease in fabrication, the internal ground layer having a metal pattern devoid of metal at a location of a via not connected to the ground layer.

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