Multi-layer interconnect module and method of interconnection

• US 20020105083A1
• Filed: 02/01/2002
• Published: 08/08/2002
• Est. Priority Date: 09/28/2000
• Status: Active Grant

• Current Assignee: Eutrend Technology, Inc.
• Original Assignee: EIC Limited (EIC Group Holdings Limited)
• Inventors: Wang, Nanlei Larry, Sun, Xiao-Peng
• Granted Patent: US 6,700,076 B2
• Time in Patent Office: Days
• US Class Current: 257/758
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/09627 : Special connections between adjacent vias, not for grounding vias
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3452 : Solder masks
• CPC Class Codes: H05K 3/429 : Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

An electronic module includes an interconnect module having a plurality of metal layers separated by a plurality of dielectric layers in a stacked structure with electronic components mounted on one surface of the module. The electronic components are selectively interconnected by drilling via holes completely through all dielectric layers with a conductive material such as solder in each via contacting metal layers to be interconnected and each metal layer which is not connected by a via having a metal pattern devoid of metal at the via location. For via connecting non-ground layers, there will be a patch of solder mask on the backside ground layer to electrically prevent this via from inadvertently connecting to ground.

Claims

1. A multi-layer microwave interconnect module having a top surface and a bottom surface and comprising:

four metal layers separated by a plurality of dielectric layers including a top signal layer on the top surface, a bottom metal layer on the bottom surface, an internal ground layer, and an internal signal layer, the top signal layer providing contacts for electrical components mounted on the module, the internal signal layer providing a metal trace for cooperating with the internal ground layer as a microstrip, and the bottom metal layer providing a bottom ground plane and at least one input/output contact, and

conductive vias selectively connecting at least one contact in the top signal layer to the bottom ground plane, at least one contact from the top signal layer to the at least one input/output contact, and contacts in the top signal layer to the metal trace in the internal signal layer, the conductive vias extending from the top surface to the bottom surface for ease in fabrication, the internal ground layer having a metal pattern devoid of metal at a location of a via not connected to the ground layer.

2. The multi-layer microwave interconnect module as defined by claim 1 and further including a solder mask overlying the bottom surface and the conductive vias selectively interconnecting contacts in the top surface to the metal trace in the internal signal layer.

3. The multi-layer microwave interconnect module as defined by claim 2 wherein the dielectric comprises alumina.

4. The multi-layer microwave interconnect module as defined by claim 2 wherein the dielectric layer is selected from the group consisting of FR4, Getek, and BT.

5. The multi-layer microwave interconnect module as defined by claim 2 wherein the metal layer comprises copper.

6. The multi-layer microwave interconnect module as defined by claim 2 wherein the metal layer comprises a gold plated refractory metal.

7. The multi-layer microwave interconnect module as defined by claim 1 wherein the dielectric layer comprises alumina.

8. The multi-layer microwave interconnect module as defined by claim 1 wherein the dielectric layer selected from the group consisting of FR4, Getek, and BT.

9. The multi-layer microwave interconnect module as defined by claim 1 wherein the metal layer comprises copper.

10. The multi-layer microwave interconnect module as defined by claim 1 wherein the metal layer comprises a gold plated refractory metal.

11. A microwave electronic module having a top surface and a bottom surface and comprising:

four metal layers separated by a plurality of dielectric layers with a top signal layer on the top surface, a bottom metal layer on the bottom surface, an internal ground layer, and an internal signal layer, the top signal layer providing contacts for electrical components mounted on the module, the internal signal layer providing a metal trace for cooperating with the internal ground layer as a microstrip, and the bottom metal layer providing a bottom ground plane and at least one input/output contact,

a plurality of electronic components mounted on the top surface of the module, and

conductive vias selectively connecting at least one contact in the top signal line to the bottom ground plane, at least one contact in the top signal layer to the at least one input/output contact, and contacts in the top signal layer to the metal trace in the internal signal layer, the conductive vias extending from the top surface to the bottom surface for ease in fabrication, the internal ground layer having a metal pattern devoid of metal where a via is not connected to the ground layer.

12. The multi-layer microwave interconnect module as defined by claim 11 and further including a solder mask overlying the bottom surface and the conductive vias selectively interconnecting contacts in the top surface to the metal trace in the internal signal layer.

13. The multi-layer microwave interconnect module as defined by claim 12 wherein the dielectric comprises alumina.

14. The multi-layer microwave interconnect module as defined by claim 12 wherein the dielectric layer is selected from the group consisting of FR4, Getek, and BT.

15. The multi-layer microwave interconnect module as defined by claim 12 wherein the metal layer comprises copper.

16. The multi-layer microwave interconnect module as defined by claim 12 wherein the metal layer comprises a gold plated refractory metal.

17. The multi-layer microwave interconnect module as defined by claim 11 wherein the dielectric comprises alumina.

18. The multi-layer microwave interconnect module as defined by claim 11 wherein the dielectric layer is selected from the group consisting of FR4, Getek, and BT.

19. The multi-layer microwave interconnect module as defined by claim 11 wherein the metal layer comprises copper.

20. The multi-layer microwave interconnect module as defined by claim 11 wherein the metal layer comprises a gold plated refractory metal.