Novel high temperature underfilling material with low exotherm during use

• US 20020106515A1
• Filed: 12/13/2000
• Published: 08/08/2002
• Est. Priority Date: 12/13/2000
• Status: Active Grant

• Current Assignee: National Starch and Chemical Investment Holding Corporation
• Original Assignee: National Starch and Chemical Investment Holding Corporation
• Inventors: Ruyters, Michel, Carpenter, Neil M.
• Granted Patent: US 6,548,575 B2
• Time in Patent Office: Days
• US Class Current: 428/413
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: Y10T 428/31511 Of epoxy ether

Abstract

A curable underfill composition comprising an epoxy containing a curing agent component and a latent accelerator component. The accelerator component comprises a material which produces a resin with an exotherm below 300 J/g. Further, the combination may be utilized in an unfilled state which allows the epoxy to remain very viscous and thus increases the speed of the underfill process in comparison to filled epoxy compositions and epoxy compositions containing different accelerator components.

Claims

1. A curable underfill composition comprising a resin, a curing agent, a filler material and an accelerator agent, wherein the composition has an exotherm of less than 300 J/g.

2. A curable underfill composition according to claim 1, wherein the accelerator agent has an exotherm of less than 250 J/g.

3. A curable underfill composition according to claim 2, wherein the accelerator agent has an exotherm of less than 200 J/g.

4. A curable underfill composition according to claim 1, wherein the accelerator agent comprises ANCAMINE 2441.

5. A curable underfill composition according to claim 4, wherein the composition comprises in the range of about 10 to 90 weight percent resin, in the range of about 5 to 20 weight percent reactive diluent, in the range of about 1-25% curing agent, in the range of about 1 to 10 weight percent ANCAMINE 2441 and in the range of about 30 to 80 weight percent filler.

6. A curable underfill composition a according to claim 5, wherein the composition comprises in the range of about 70 to 75 weight percent epoxy resin, in the range of about 15 to 20 weight percent reactive diluent, in the range of about 2.5 to 4 weight percent curing agent and about 3 to 5 weight percent ANCAMINE 2441.

7. A curable underfill composition according to claim 6, wherein the resin is a monofunctional or multifunctional resin or a combination thereof.

8. A curable underfill composition according to claim 7, wherein the resin is a bisphenol A, bisphenol F, epoxy phenol novalac, cresol novalac, polyepoxy compound based on aromatic amines and epichlorohydrin, or mixtures thereof.

9. A curable underfill composition according to claim 8, wherein the resin is a mixture of bisphenol A and bisphenol F.

10. A curable underfill composition according to claim 5, wherein the filler is selected from the group consisting of silica, mica, alumina or mixtures thereof.

11. A curable underfill composition according to claim 5, wherein the curing agent is selected from the group consisting of dicyanidiamide, blocked imidazoles, blocked polyamides, or mixtures thereof.

12. A curable underfill composition according to claim 11, wherein the curing agent is dicyanidiamide.

13. A curable underfill composition according to claim 5, wherein the reactive diluent is p-tert butyl phenylglycidylether.

15. A curable underfill composition according to claim 5, wherein the composition further comprises a non-gritty pigment.

16. A curable underfill composition according to claim 15, wherein the non-gritty pigment is Sandorin Red BN.

14. A curable underfill composition consisting essentially of in the range of about 10 to 90 weight percent resin, in the range of about 5 to 20 weight percent reactive diluent, in the range of about 1-25% curing agent, in the range of about 1 to 10 weight percent ANCAMINE 2441 and in the range of about 30 to 80 weight percent filler.

17. A method for making an electronic assembly in which an electronic component is bonded to a substrate comprising the steps of:

a) providing a substrate and an electrical component;

b) providing a resin containing a curing agent, a filler and an accelerator agent having an exotherm of less than 300 J/g;

c) placing the resin between the substrate and the electrical component; and

d) allowing the resin to cure to bond the substrate and the electrical component.

18. An electronic assembly prepared by the method according to claim 17.