Novel high temperature underfilling material with low exotherm during use
First Claim
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1. A curable underfill composition comprising a resin, a curing agent, a filler material and an accelerator agent, wherein the composition has an exotherm of less than 300 J/g.
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Abstract
A curable underfill composition comprising an epoxy containing a curing agent component and a latent accelerator component. The accelerator component comprises a material which produces a resin with an exotherm below 300 J/g. Further, the combination may be utilized in an unfilled state which allows the epoxy to remain very viscous and thus increases the speed of the underfill process in comparison to filled epoxy compositions and epoxy compositions containing different accelerator components.
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Citations
18 Claims
- 1. A curable underfill composition comprising a resin, a curing agent, a filler material and an accelerator agent, wherein the composition has an exotherm of less than 300 J/g.
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14. A curable underfill composition consisting essentially of in the range of about 10 to 90 weight percent resin, in the range of about 5 to 20 weight percent reactive diluent, in the range of about 1-25% curing agent, in the range of about 1 to 10 weight percent ANCAMINE 2441 and in the range of about 30 to 80 weight percent filler.
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17. A method for making an electronic assembly in which an electronic component is bonded to a substrate comprising the steps of:
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a) providing a substrate and an electrical component;
b) providing a resin containing a curing agent, a filler and an accelerator agent having an exotherm of less than 300 J/g;
c) placing the resin between the substrate and the electrical component; and
d) allowing the resin to cure to bond the substrate and the electrical component. - View Dependent Claims (18)
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Specification